256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, MSOP-8
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
零件包装代码 | MSOP |
包装说明 | TSSOP, |
针数 | 8 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
最大时钟频率 (fCLK) | 0.4 MHz |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 3 mm |
内存密度 | 2048 bi |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 8 |
字数 | 256 words |
字数代码 | 256 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
组织 | 256X8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
并行/串行 | SERIAL |
峰值回流温度(摄氏度) | 260 |
认证状态 | Not Qualified |
座面最大高度 | 1.18 mm |
串行总线类型 | I2C |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.8 V |
标称供电电压 (Vsup) | 2.5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 3 mm |
最长写入周期时间 (tWC) | 5 ms |
Base Number Matches | 1 |
24AA02-E/MSG | 24AA02-E/PG | 24AA02-E/SNG | 24AA02-E/STG | 24AA02T-E/STG | 24AA02T-E/SNG | 24AA02T-E/MSG | 24AA02T-E/OTG | 24AA02HT-I/MC | |
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描述 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, MO-153, TSSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, MO-153, TSSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, MS-012, SOIC-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, PLASTIC, MSOP-8 | 256 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO5, PLASTIC, MO-178, SOT-23, 5 PIN | eeprom 2K 256 X 8 serial EE 18v ind 1/2 array WP |
组织 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256X8 | 256 x 8 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
零件包装代码 | MSOP | DIP | SOIC | TSSOP | TSSOP | SOIC | MSOP | SOIC | - |
包装说明 | TSSOP, | DIP, | SOP, | TSSOP, | TSSOP, | SOP, | TSSOP, | LSSOP, | - |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 5 | - |
Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | - |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | - |
JESD-30 代码 | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G5 | - |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | - |
长度 | 3 mm | 9.46 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.9 mm | 3 mm | 2.95 mm | - |
内存密度 | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | 2048 bi | - |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 5 | - |
字数 | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | 256 words | - |
字数代码 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | - |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | TSSOP | DIP | SOP | TSSOP | TSSOP | SOP | TSSOP | LSSOP | - |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | - |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | - |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - |
峰值回流温度(摄氏度) | 260 | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 | 260 | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 1.18 mm | 4.32 mm | 1.75 mm | 1.1 mm | 1.1 mm | 1.75 mm | 1.18 mm | 1.45 mm | - |
串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 1.8 V | 1.7 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | - |
标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
表面贴装 | YES | NO | YES | YES | YES | YES | YES | YES | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
端子节距 | 0.65 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.95 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | 40 | 40 | 40 | 40 | 40 | 40 | - |
宽度 | 3 mm | 7.62 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm | 3 mm | 1.63 mm | - |
最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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