
JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | TFBGA, BGA176,11X20,25 |
| 针数 | 176 |
| Reach Compliance Code | compli |
| Factory Lead Time | 1 week |
| 系列 | S |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PBGA-B176 |
| JESD-609代码 | e1 |
| 长度 | 13.5 mm |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 反相输出次数 | |
| 端子数量 | 176 |
| 实输出次数 | |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装等效代码 | BGA176,11X20,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 包装方法 | TR |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 1.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 标称供电电压 (Vsup) | 1.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.65 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8 mm |
| SN74SSQE32882ZALR | SN74SSQE32882ZCJR | |
|---|---|---|
| 描述 | JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 | Registers 28B-56B Registered Buffer |
| Brand Name | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA |
| 包装说明 | TFBGA, BGA176,11X20,25 | TFBGA, BGA176,8X22,25 |
| 针数 | 176 | 176 |
| Reach Compliance Code | compli | compli |
| 系列 | S | S |
| 输入调节 | STANDARD | STANDARD |
| JESD-30 代码 | R-PBGA-B176 | S-PBGA-B176 |
| 长度 | 13.5 mm | 15 mm |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER |
| 功能数量 | 1 | 1 |
| 端子数量 | 176 | 176 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFBGA | TFBGA |
| 封装等效代码 | BGA176,11X20,25 | BGA176,8X22,25 |
| 封装形状 | RECTANGULAR | SQUARE |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY |
| 峰值回流温度(摄氏度) | 260 | NOT SPECIFIED |
| 电源 | 1.5 V | 1.5 V |
| 认证状态 | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm |
| 标称供电电压 (Vsup) | 1.5 V | 1.5 V |
| 表面贴装 | YES | YES |
| 技术 | CMOS | CMOS |
| 端子形式 | BALL | BALL |
| 端子节距 | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8 mm | 6 mm |
| 器件名 | 厂商 | 描述 |
|---|---|---|
| SN74SSQEA32882ZALR | Texas Instruments(德州仪器) | JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 |
| SSTE32882KA1AKG | IDT (Integrated Device Technology) | Registers LOW VOLTAGE REGISTER DDR3 |
| SN74SSQEB32882ZALR | Texas Instruments(德州仪器) | JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test 176-NFBGA 0 to 85 |
| SSTE32882HLBAKG | IDT (Integrated Device Technology) | CABGA-176, Tray |
| SSTE32882KA1AKG8 | IDT (Integrated Device Technology) | CABGA-176, Reel |
| SSTE32882KB1AKG8 | IDT (Integrated Device Technology) | CABGA-176, Reel |
| SSTE32882HLBAKG8 | IDT (Integrated Device Technology) | CABGA-176, Reel |
| SSTE32882HLBBKG8 | IDT (Integrated Device Technology) | Registers DDR3 LV REGISTER |
| SN74SSQE32882ZCJR | Texas Instruments(德州仪器) | Registers 28B-56B Registered Buffer |
| SSTE32882HLBBKG | IDT (Integrated Device Technology) | PLL Based Clock Driver, SSTE Series, 4 True Output(s), 0 Inverted Output(s), CMOS, PBGA176, 8 X 13.50 MM, 0.65 MM PITCH, GREEN, MO-246F, CABGA-176 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved