|
SN74AUC1G66DCKR |
SN74AUC1G66DBVR |
SN74AUC1G66DCKRE4 |
SN74AUC1G66DBVRE4 |
SN74AUC1G66YZPR |
| 描述 |
Single Bilateral Analog Switch 5-SC70 -40 to 85 |
Single Bilateral Analog Switch 5-SOT-23 -40 to 85 |
Single Bilateral Analog Switch 5-SC70 -40 to 85 |
Analog Switch ICs SNGL Bilateral Analog SWCH |
Single Bilateral Analog Switch 5-DSBGA -40 to 85 |
| Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
| 是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
| 是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
| 零件包装代码 |
SOIC |
SOT-23 |
SOIC |
SOT-23 |
SOIC |
| 包装说明 |
SC-70, 5 PIN |
SOT-23, 5 PIN |
TSSOP, |
LSSOP, TSOP5/6,.11,37 |
TSSOP, |
| 针数 |
5 |
5 |
5 |
5 |
5 |
| Reach Compliance Code |
compliant |
compliant |
compli |
compli |
compli |
| Factory Lead Time |
1 week |
1 week |
6 weeks |
8 weeks |
1 week |
| 厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
| ECCN代码 |
EAR99 |
EAR99 |
- |
- |
EAR99 |
| 模拟集成电路 - 其他类型 |
SPST |
SPST |
SPST |
- |
SPST |
| 标称带宽 |
500 MHz |
500 MHz |
500 MHz |
- |
500 MHz |
| JESD-30 代码 |
R-PDSO-G5 |
R-PDSO-G5 |
R-PDSO-G5 |
- |
R-PDSO-G5 |
| JESD-609代码 |
e4 |
e4 |
e4 |
- |
e1 |
| 长度 |
2 mm |
2.9 mm |
2 mm |
- |
2 mm |
| 湿度敏感等级 |
1 |
1 |
1 |
- |
1 |
| 信道数量 |
1 |
1 |
1 |
- |
1 |
| 功能数量 |
1 |
1 |
1 |
- |
1 |
| 端子数量 |
5 |
5 |
5 |
- |
5 |
| 标称断态隔离度 |
55 dB |
55 dB |
55 dB |
- |
55 dB |
| 最大通态电阻 (Ron) |
20 Ω |
20 Ω |
20 Ω |
- |
20 Ω |
| 最高工作温度 |
85 °C |
85 °C |
85 °C |
- |
85 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
-40 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
| 封装代码 |
TSSOP |
LSSOP |
TSSOP |
- |
TSSOP |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
| 封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) |
260 |
260 |
260 |
- |
260 |
| 认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
| 座面最大高度 |
1.1 mm |
1.45 mm |
1.1 mm |
- |
1.1 mm |
| 最大供电电压 (Vsup) |
2.7 V |
2.7 V |
2.7 V |
- |
2.7 V |
| 最小供电电压 (Vsup) |
0.8 V |
0.8 V |
0.8 V |
- |
0.8 V |
| 标称供电电压 (Vsup) |
1.65 V |
1.65 V |
1.65 V |
- |
1.65 V |
| 表面贴装 |
YES |
YES |
YES |
- |
YES |
| 最长断开时间 |
2.9 ns |
2.9 ns |
2.9 ns |
- |
2.9 ns |
| 最长接通时间 |
1.1 ns |
1.1 ns |
1.1 ns |
- |
1.1 ns |
| 技术 |
CMOS |
CMOS |
CMOS |
- |
CMOS |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
INDUSTRIAL |
| 端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 |
GULL WING |
GULL WING |
GULL WING |
- |
GULL WING |
| 端子节距 |
0.65 mm |
0.95 mm |
0.65 mm |
- |
0.65 mm |
| 端子位置 |
DUAL |
DUAL |
DUAL |
- |
DUAL |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
NOT SPECIFIED |
| 宽度 |
1.25 mm |
1.6 mm |
1.25 mm |
- |
1.25 mm |
| Base Number Matches |
1 |
1 |
1 |
- |
- |