Surface Mount Rectifier
Features:
•
•
•
•
•
•
•
Low Profile Package
For Surface Mounted Applications
Built-In Strain Relief, Ideal for Automated Placement
High Temperature Soldering : 250°C/10 seconds at Terminals
Easy Pick and Place
Ultrafast Recovery Times for High Efficiency
Low Forward Voltage, Low Power Loss
Mechanical Data
•
•
•
•
Case : JEDEC DO-214AA, molded plastic over passivated chip
Terminals : solder plated, solderable per MIL-STD-750, method 2026
Polarity : Colour band denotes cathode end
Weight : 0.002oz, 0.064g
Maximum Ratings and Thermal Characteristics
Characteristic
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current at T
L
=110°C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
Maximum instantaneous forward voltage at 1A
Maximum DC reverse current T
A
=25°C
at rated DC blocking voltage T
A
=125°C
Maximum reverse recovery time
at I
F
=0.5A I
R
=1.A I
rr
=0.25A
Typical junction capacitance at 4V,1MHz
Maximum thermal resistance (Note1)
Operating junction and storage temperature range
Note:
(1) PCB mounted on 0.2ʺ × 0.2ʺ (5 × 5mm
2
) copper pad areas
Ratings at 25°C ambient temperature unless otherwise specified
Symbol
V
RRM
V
RWS
V
DC
I
F(AV)
I
FSM
V
F
I
R
t
rr
C
J
R
θJA
R
θJL
T
J,
T
STG
US1J-13-F
600
420
600
US1K-13-F
800
560
800
1
30
1.7
5
100
75
15
55
20
-55 to +150
US1M-13-F
1,000
700
1,000
Units
V
V
V
A
A
V
μA
ns
pF
°CW
°C
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Page <1>
25/02/13
V1.0
Surface Mount Rectifier
Package Outline Dimensions
Dim.
A
B
C
D
E
F
G
H
I
1.9
1.35
0.9
0.2 Max.
2.3
1.65
DO-214AC(SMA)
Min.
4.25
2.4
1.85
4.85
0.2 Typ.
1.5
Max.
4.65
2.8
2.15
5.35
Dimensions : Millimetres
Soldering Footprint
Package Information
Device
US1J-13-F
US1K-13-F
US1M-13-F
Package
DO-214AC(SMA)
Shipping
5,000 / Tape & Reel
Dimensions : Millimetres
Part Number Table
Description
Surface Mount Rectifier
Part Number
US1J-13-F
US1K-13-F
US1M-13-F
Important Notice :
This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
www.element14.com
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Page <3>
25/02/13
V1.0