IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | FBGA, BGA10,3X4,20 |
| Reach Compliance Code | unknown |
| 控制模式 | CURRENT/VOLTAGE-MODE |
| JESD-30 代码 | R-PBGA-B10 |
| 湿度敏感等级 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -25 °C |
| 最大输出电流 | 0.4 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA10,3X4,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 最大切换频率 | 1000 kHz |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| LM2612BBLX/NOPB | LM2612BBL/NOPB | LM2612BTLX/NOPB | LM2612BTL/NOPB | LM2612ABLX/NOPB | LM2612ABL/NOPB | LM2612ATLX/NOPB | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC | IC,SMPS CONTROLLER,CURRENT/VOLTAGE,CMOS,BGA,10PIN,PLASTIC |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 | FBGA, BGA10,3X4,20 |
| Reach Compliance Code | unknown | unknown | compliant | compliant | unknown | unknown | compliant |
| 控制模式 | CURRENT/VOLTAGE-MODE | CURRENT/VOLTAGE-MODE | CURRENT/VOLTAGE-MODE | CURRENT/VOLTAGE-MODE | CURRENT/VOLTAGE-MODE | CURRENT/VOLTAGE-MODE | CURRENT/VOLTAGE-MODE |
| JESD-30 代码 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 | R-PBGA-B10 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 最大输出电流 | 0.4 A | 0.4 A | 0.3 A | 0.3 A | 0.51 A | 0.51 A | 0.4 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
| 封装等效代码 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 | BGA10,3X4,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 最大切换频率 | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
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