EEPROM, 512X8, Serial, CMOS, CDIP8, 0.300 INCH, CERDIP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 0.1 MHz |
| JESD-30 代码 | R-GDIP-T8 |
| JESD-609代码 | e0 |
| 长度 | 9.8425 mm |
| 内存密度 | 4096 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512X8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 串行总线类型 | I2C |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| 最长写入周期时间 (tWC) | 1 ms |
| Base Number Matches | 1 |
| 24C04AE/J | 24C01A-I/J | 24C04A/J | 24C04A-E/J | 24C01A-E/J | 24C04A-I/J | 24C02A-E/J | 24C02AE/J | 24C01A/J | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 512X8, Serial, CMOS, CDIP8, 0.300 INCH, CERDIP-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, CDIP8, CERDIP-8 | EEPROM, 512X8, Serial, CMOS, CDIP8, 0.300 INCH, CERDIP-8 | 512X8 I2C/2-WIRE SERIAL EEPROM, CDIP8, CERDIP-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, CDIP8, CERDIP-8 | EEPROM, 512X8, Serial, CMOS, CDIP8, CERDIP-8 | 256X8 I2C/2-WIRE SERIAL EEPROM, CDIP8, CERDIP-8 | 256X8 I2C/2-WIRE SERIAL EEPROM, CDIP8, 0.300 INCH, CERDIP-8 | 128X8 I2C/2-WIRE SERIAL EEPROM, CDIP8, 0.300 INCH, CERDIP-8 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | CERDIP-8 | CERDIP-8 | 0.300 INCH, CERDIP-8 | DIP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| 最大时钟频率 (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| JESD-30 代码 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 | R-GDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4096 bi | 1024 bi | 4096 bi | 4096 bi | 1024 bi | 4096 bi | 2048 bi | 2048 bi | 1024 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 512 words | 128 words | 512 words | 512 words | 128 words | 512 words | 256 words | 256 words | 128 words |
| 字数代码 | 512 | 128 | 512 | 512 | 128 | 512 | 256 | 256 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 85 °C | 70 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 组织 | 512X8 | 128X8 | 512X8 | 512X8 | 128X8 | 512X8 | 256X8 | 256X8 | 128X8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | COMMERCIAL | Not Qualified | COMMERCIAL | COMMERCIAL | Not Qualified | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最长写入周期时间 (tWC) | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms | 1 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 其他特性 | - | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | - | 10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 100K ERASE/WRITE CYCLES MIN; HARDWARE WRITE PROTECT; DATA RETENTION > 40 YEARS | 10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | - | - |
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