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IDT6116LA15Y

产品描述Standard SRAM, 2KX8, 15ns, CMOS, PDSO24, 0.300 INCH, 1.27 MM PITCH, SOJ-24
产品类别存储    存储   
文件大小108KB,共11页
制造商IDT (Integrated Device Technology)
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IDT6116LA15Y概述

Standard SRAM, 2KX8, 15ns, CMOS, PDSO24, 0.300 INCH, 1.27 MM PITCH, SOJ-24

IDT6116LA15Y规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码SOJ
包装说明0.300 INCH, 1.27 MM PITCH, SOJ-24
针数24
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间15 ns
I/O 类型COMMON
JESD-30 代码R-PDSO-J24
JESD-609代码e0
长度15.88 mm
内存密度16384 bit
内存集成电路类型STANDARD SRAM
内存宽度8
湿度敏感等级3
功能数量1
端口数量1
端子数量24
字数2048 words
字数代码2000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2KX8
输出特性3-STATE
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码SOJ
封装等效代码SOJ24,.34
封装形状RECTANGULAR
封装形式SMALL OUTLINE
并行/串行PARALLEL
电源5 V
认证状态Not Qualified
座面最大高度3.76 mm
最大待机电流0.00002 A
最小待机电流2 V
最大压摆率0.14 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式J BEND
端子节距1.27 mm
端子位置DUAL
宽度7.62 mm

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CMOS Static RAM
16K (2K x 8-Bit)
IDT6116SA
IDT6116LA
x
Features
High-speed access and chip select times
– Military: 20/25/35/45/55/70/90/120/150ns (max.)
– Industrial: 20/25/35/45ns (max.)
– Commercial: 15/20/25/35/45ns (max.)
Low-power consumption
Battery backup operation
– 2V data retention voltage (LA version only)
Produced with advanced CMOS high-performance
technology
CMOS process virtually eliminates alpha particle soft-error
rates
Input and output directly TTL-compatible
Static operation: no clocks or refresh required
Available in ceramic and plastic 24-pin DIP, 24-pin Thin Dip,
24-pin SOIC and 24-pin SOJ
Military product compliant to MIL-STD-833, Class B
Description
The IDT6116SA/LA is a 16,384-bit high-speed static RAM
organized as 2K x 8. It is fabricated using IDT's high-performance,
high-reliability CMOS technology.
Access times as fast as 15ns are available. The circuit also offers a
reduced power standby mode. When
CS
goes HIGH, the circuit will
automatically go to, and remain in, a standby power mode, as long
as
CS
remains HIGH. This capability provides significant system level
power and cooling savings. The low-power (LA) version also offers a
battery backup data retention capability where the circuit typically
consumes only 1µW to 4µW operating off a 2V battery.
All inputs and outputs of the IDT6116SA/LA are TTL-compatible. Fully
static asynchronous circuitry is used, requiring no clocks or refreshing
for operation.
The IDT6116SA/LA is packaged in 24-pin 600 and 300 mil plastic or
ceramic DIP, 24-lead gull-wing SOIC, and 24-lead J-bend SOJ providing
high board-level packing densities.
Military grade product is manufactured in compliance to the latest
version of MIL-STD-883, Class B, making it ideally suited to military
temperature applications demanding the highest level of performance and
reliability.
x
x
x
x
x
x
x
x
Functional Block Diagram
A
0
V
CC
ADDRESS
DECODER
A
10
128 X 128
MEMORY
ARRAY
GND
I/O
0
INPUT
DATA
CIRCUIT
I/O
7
I/O CONTROL
,
CS
OE
WE
CONTROL
CIRCUIT
3089 drw 01
FEBRUARY 2001
1
©2000 Integrated Device Technology, Inc.
DSC-3089/03

IDT6116LA15Y相似产品对比

IDT6116LA15Y IDT6116LA20DB IDT6116SA20DB IDT6116SA25DB
描述 Standard SRAM, 2KX8, 15ns, CMOS, PDSO24, 0.300 INCH, 1.27 MM PITCH, SOJ-24 Standard SRAM, 2KX8, 19ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24 Standard SRAM, 2KX8, 19ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24 Standard SRAM, 2KX8, 25ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24
是否Rohs认证 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 SOJ DIP DIP DIP
包装说明 0.300 INCH, 1.27 MM PITCH, SOJ-24 0.600 INCH, CERDIP-24 DIP, DIP24,.6 0.600 INCH, CERDIP-24
针数 24 24 24 24
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
最长访问时间 15 ns 19 ns 19 ns 25 ns
I/O 类型 COMMON COMMON COMMON COMMON
JESD-30 代码 R-PDSO-J24 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24
JESD-609代码 e0 e0 e0 e0
长度 15.88 mm 32.004 mm 32.004 mm 32.004 mm
内存密度 16384 bit 16384 bit 16384 bit 16384 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 8 8 8 8
功能数量 1 1 1 1
端口数量 1 1 1 1
端子数量 24 24 24 24
字数 2048 words 2048 words 2048 words 2048 words
字数代码 2000 2000 2000 2000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 125 °C 125 °C 125 °C
最低工作温度 - -55 °C -55 °C -55 °C
组织 2KX8 2KX8 2KX8 2KX8
输出特性 3-STATE 3-STATE 3-STATE 3-STATE
可输出 YES YES YES YES
封装主体材料 PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
封装代码 SOJ DIP DIP DIP
封装等效代码 SOJ24,.34 DIP24,.6 DIP24,.6 DIP24,.6
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE IN-LINE IN-LINE IN-LINE
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
电源 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.76 mm 4.826 mm 4.826 mm 4.826 mm
最大待机电流 0.00002 A 0.0002 A 0.01 A 0.01 A
最小待机电流 2 V 2 V 4.5 V 4.5 V
最大压摆率 0.14 mA 0.14 mA 0.15 mA 0.135 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V
表面贴装 YES NO NO NO
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL MILITARY MILITARY MILITARY
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 J BEND THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
端子节距 1.27 mm 2.54 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL
宽度 7.62 mm 15.24 mm 15.24 mm 15.24 mm
峰值回流温度(摄氏度) - NOT SPECIFIED 225 NOT SPECIFIED
筛选级别 - 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
处于峰值回流温度下的最长时间 - NOT SPECIFIED 20 NOT SPECIFIED
Base Number Matches - 1 1 1

 
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