IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| 控制类型 | ENABLE HIGH |
| 系列 | LS |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.495 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.024 A |
| 位数 | 4 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 传播延迟（tpd） | 18 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| SN74LS126AJD | SN74LS126ADR2 | 54LS125A/BCBJC | 54LS125A/BDAJC | SN74LS125ANDS | SN74LS125AJD | AER23-23-12CB/S | SN74LS126ANDS | SN74LS126AJ | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,SOP,14PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,FP,14PIN,CERAMIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC | AER Forged Heat Sinks | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,4-BIT,LS-TTL,DIP,14PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | DIP, DIP14,.3 | SOP, SOP14,.25 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | - | unknown | unknown |
| 控制类型 | ENABLE HIGH | ENABLE HIGH | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | ENABLE HIGH | ENABLE HIGH |
| JESD-30 代码 | R-XDIP-T14 | R-PDSO-G14 | R-XDIP-T14 | R-XDFP-F14 | R-PDIP-T14 | R-XDIP-T14 | - | R-PDIP-T14 | R-XDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.024 A | 0.024 A | - | 0.024 A | 0.024 A |
| 位数 | 4 | 4 | 4 | 4 | 4 | 4 | - | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | - | 14 | 14 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | - | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | - | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | DIP | SOP | DIP | DFP | DIP | DIP | - | DIP | DIP |
| 封装等效代码 | DIP14,.3 | SOP14,.25 | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | - | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE | IN-LINE | - | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | NO | - | NO | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | - | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL |
Linux开发
电源技术
测试/测量
下载中心专版
单片机
电源技术
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
