电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

D3899926JJ29JN

产品描述MIL Series Connector, 29 Contact(s), Aluminum Alloy, Female, Crimp Terminal, Plug,
产品类别连接器    连接器   
文件大小707KB,共13页
制造商Smiths Group
下载文档 详细参数 全文预览

D3899926JJ29JN在线购买

供应商 器件名称 价格 最低购买 库存  
D3899926JJ29JN - - 点击查看 点击购买

D3899926JJ29JN概述

MIL Series Connector, 29 Contact(s), Aluminum Alloy, Female, Crimp Terminal, Plug,

D3899926JJ29JN规格参数

参数名称属性值
厂商名称Smiths Group
Reach Compliance Codeunknown
其他特性STANDARD: MIL-DTL-38999, EMI SHIELDED
后壳类型SOLID
主体/外壳类型PLUG
连接器类型MIL SERIES CONNECTOR
联系完成配合GOLD OVER NICKEL
联系完成终止GOLD OVER NICKEL
触点性别FEMALE
耦合类型THREADED
DIN 符合性NO
空壳NO
环境特性FLUID/IMMERSION RESISTANT
滤波功能NO
IEC 符合性NO
JESD-609代码e4
MIL 符合性YES
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装类型CABLE
选件GENERAL PURPOSE
外壳面层OLIVE DRAB CADMIUM PLATED
外壳材料ALUMINUM ALLOY
外壳尺寸J
端接类型CRIMP
触点总数29

文档预览

下载PDF文档
HyperRel Series
HyperRel Series
Ruggedized Connectors Intermateable
with MIL-DTL-38999 Series III
Available with metal (HRM) and composite (HRC) shells
Ruggedized socket interconnects
High shock and vibration resistance
Metal and composite shell styles
Hypertac
®
style 39029 contacts
Intermateable with industry standard Mil 38999
Series III connectors
• Cable-to-cable and panel mount styles available
• Available with high temperature hyperboloid
contact technology
HRC (HyperRel Composite): Highlights
The HyperRel HRC is a high performance composite
connector intermateable with MIL-DTL-38999 Series III
connectors. The combination of the legendary Hypertac
contact with the superior design of the composite
shell/insert, along with the respective strain reliefs, favorably
influence intra-system life-cycle performance and costs.
Shells:
The total performance of the HRC connector is
matched by the individual components within the system.
For example, the use of composite materials increases
the durability of the connector housing and coupling
mechanism to 1500 cycles.
Specifications:
EMI shielding effectiveness
Meets and exceeds the requirements of MIL-DTL-38999,
paragraph 3.3.1
Fluid immersion
Meets and exceeds the requirements of MIL-DTL-38999,
paragraph 3.33
Temperature
The metal surface will not delaminate from the composite
material even after extreme temperature excursions.
The HRC meets all requirements of MIL-DTL-38999,
paragraph 3.8
Magnetic permeability
The magnetic permeability of the fully assembled HRC
connector is less than 2.0 µ, meeting all the requirements
of MIL-DTL-38999, paragraph 3.3.4
Materials
All the materials used in the shell and inserts in the HRC
are in accordance with MIL-DTL-38999, paragraph 3.3.
The contacts are in accordance with MIL-C-39029,
paragraph 3.3
Finish
Shells: Meet the requirements of MIL-DTL-38999
Contacts: Meets the requirements of MIL-C-39029
Insulation resistance
Meets all the requirements of MIL-DTL-38999,
paragraph 3.13
Dielectric withstanding voltage
Meets all the requirements of MIL-DTL-38999,
paragraph 3.14
Contacts:
Up to 80% less mating force
50% reduction in resistance
300% increase in mating cycles
Vibration/shock proven at 2 nano seconds
Five times more contact elements than the
MIL-C-39029 (e.g. Size number 22)
• Hypertac contact life expectancy (fretting) is
100 times longer than the MIL-C-39029 contact
The HRC eliminates the largest contributing factor in
advanced systems malfunction: corrosion – the main cause
of mechanical, electrical, and electromagnetic connector
degradation. Electromotive force differentials between many
dissimilar metals found in connectors and accessories
produce galvanic action. The HRC eliminates these dissimilar
metals resulting in an interconnect system that withstands
over 2000 hours of salt spray.
Dimensions are in inches [mm]
www.hypertronics.com
2 / 37
PC机的中断不是总共只有16个吗,从IRQ0-IRQ15?那为什么在设备管理器里面看到有的设备的中断号大于16
PC机的中断不是总共只有16个吗,从IRQ0-IRQ15?那为什么在设备管理器里面看到有的设备的中断号大于16,比如网卡,我的网卡在设备管理器里面的中断号是19 ...
363332646 嵌入式系统
ARM及嵌入式linux培训视频+dsp CPLD FPGA开发视频+嵌入式系统开发实用技术视频
ARM及嵌入式linux培训视频+dsp CPLD FPGA开发视频+嵌入式系统开发实用技术视频 少有的精品学习资料!(是一个培训班的授课内容,参加这个培训班费用要4千多元!) 看这个视频差不多相当于上 ......
yingzi9 Linux开发
Platform Builder 5.0下的Build and Sysgen Current BSP问题,大家来讨论一下
应该是前天吧,一直在调试SD卡和串口的驱动,但突然等我把内核Sysgen好后通过BIOS下载到SDRAM中却无法运行了,DNW显示的信息是“Dabort exception!!!”,这是在引导程序中设定的,也就是数据中 ......
tangwenwenit 嵌入式系统
非常时期 少出门多学习: 多部TI实用课程奉上, 身体不能在路上就让灵魂在路上
获奖名单如下,恭喜各位 用户名 奖品 山楂的锅盔 米家台灯 Mersenne 米家台灯 isunspot@ 米家台灯 ......
EE大学堂 能源基础设施
总算考完了
苦逼的孩子总算考完了~~~~...
hangsky 聊聊、笑笑、闹闹
新手求助
我现在想做一个按键的界面 应该怎么弄好 是不是要用API或者MFC啊??? 是不是要看VC++6.0方面的书啊? 新手。。。 ...
lhgxcl 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1489  679  1391  1458  2128  1  20  44  31  22 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved