Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52
参数名称 | 属性值 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | LCC |
包装说明 | QCCJ, |
针数 | 52 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
JESD-30 代码 | S-PQCC-J52 |
JESD-609代码 | e0 |
长度 | 19.1262 mm |
内存密度 | 147456 bit |
内存集成电路类型 | CACHE SRAM |
内存宽度 | 18 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 52 |
字数 | 8192 words |
字数代码 | 8000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 8KX18 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | BICMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 19.1262 mm |
IDT71B222S18J | 33522B | IDT71B222S30J8 | IDT71B222S25J | IDT71B222S30JB8 | IDT71B222S30J | IDT71B222S30JB | IDT71B222S25JB | IDT71B222S25J8 | IDT71B222S25JB8 | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Waveform Generators | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 | Cache SRAM, 8KX18, BICMOS, PQCC52, PLASTIC, LCC-52 |
厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | LCC | - | LCC | LCC | LCC | LCC | LCC | LCC | LCC | LCC |
包装说明 | QCCJ, | - | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, |
针数 | 52 | - | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 |
Reach Compliance Code | unknown | - | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | - | EAR99 | EAR99 | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.2.C |
JESD-30 代码 | S-PQCC-J52 | - | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 19.1262 mm | - | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
内存密度 | 147456 bit | - | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit | 147456 bit |
内存集成电路类型 | CACHE SRAM | - | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
内存宽度 | 18 | - | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 52 | - | 52 | 52 | 52 | 52 | 52 | 52 | 52 | 52 |
字数 | 8192 words | - | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | - | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C |
组织 | 8KX18 | - | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 | 8KX18 |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | - | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | - | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | J BEND | - | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 19.1262 mm | - | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm |
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