BYG26G概述

DIODE 1 A, 400 V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC PACKAGE-2, Signal Diode

BYG26G规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	NXP(恩智浦)
零件包装代码	DO-214AC
包装说明	R-PDSO-C2
针数	2
Reach Compliance Code	not_compliant
ECCN代码	EAR99
其他特性	LOW LEAKAGE CURRENT
配置	SINGLE
二极管元件材料	SILICON
二极管类型	RECTIFIER DIODE
最大正向电压 (VF)	3.6 V
JEDEC-95代码	DO-214AC
JESD-30 代码	R-PDSO-C2
JESD-609代码	e0
最大非重复峰值正向电流	15 A
元件数量	1
端子数量	2
最高工作温度	175 °C
最大输出电流	1 A
封装主体材料	PLASTIC/EPOXY
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
认证状态	Not Qualified
最大重复峰值反向电压	400 V
最大反向恢复时间	0.03 µs
表面贴装	YES
技术	AVALANCHE
端子面层	Tin/Lead (Sn80Pb20)
端子形式	C BEND
端子位置	DUAL

文档预览

下载PDF文档

全文
预览

DISCRETE SEMICONDUCTORS

DATA SHEET

book, halfpage

M3D168

BYG26 series

SMA ultra fast soft-recovery

controlled avalanche rectifiers

Product speciﬁcation

2000 Feb 14

BYG26G相似产品对比

	BYG26G	934056149115	P0402Y2641WNWA	934056148115	BYG26JT/R	BYG26DT/R	BYG26D	BYG26J	934056150115
描述	DIODE 1 A, 400 V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC PACKAGE-2, Signal Diode	1A, 400V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC, SMD, SMA, 2 PIN	Fixed Resistor, Thin Film, 0.063W, 2640ohm, 50V, 0.05% +/-Tol, 10ppm/Cel, Surface Mount, 0402, CHIP	1A, 600V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC, SMD, SMA, 2 PIN	DIODE 1 A, 600 V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC PACKAGE-2, Signal Diode	DIODE 1 A, 200 V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC PACKAGE-2, Signal Diode	DIODE 1 A, 200 V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC PACKAGE-2, Signal Diode	DIODE 1 A, 600 V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC PACKAGE-2, Signal Diode	1A, 200V, SILICON, SIGNAL DIODE, DO-214AC, PLASTIC, SMD, SMA, 2 PIN
包装说明	R-PDSO-C2	R-PDSO-C2	CHIP	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2
Reach Compliance Code	not_compliant	unknown	compliant	unknown	unknown	unknown	not_compliant	not_compliant	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
端子数量	2	2	2	2	2	2	2	2	2
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMT	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	AVALANCHE	AVALANCHE	THIN FILM	AVALANCHE	AVALANCHE	AVALANCHE	AVALANCHE	AVALANCHE	AVALANCHE
是否Rohs认证	不符合	不符合	符合	不符合	-	-	不符合	不符合	-
厂商名称	NXP(恩智浦)	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)
零件包装代码	DO-214AC	DO-214AC	-	DO-214AC	DO-214AC	DO-214AC	DO-214AC	DO-214AC	DO-214AC
针数	2	2	-	2	2	2	2	2	2
配置	SINGLE	SINGLE	-	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
二极管元件材料	SILICON	SILICON	-	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON
二极管类型	RECTIFIER DIODE	RECTIFIER DIODE	-	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE	RECTIFIER DIODE
JEDEC-95代码	DO-214AC	DO-214AC	-	DO-214AC	DO-214AC	DO-214AC	DO-214AC	DO-214AC	DO-214AC
JESD-30 代码	R-PDSO-C2	R-PDSO-C2	-	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2	R-PDSO-C2
元件数量	1	1	-	1	1	1	1	1	1
最大输出电流	1 A	1 A	-	1 A	1 A	1 A	1 A	1 A	1 A
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装形状	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
认证状态	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大重复峰值反向电压	400 V	400 V	-	600 V	600 V	200 V	200 V	600 V	200 V
最大反向恢复时间	0.03 µs	0.03 µs	-	0.03 µs	0.03 µs	0.03 µs	0.03 µs	0.03 µs	0.03 µs
端子形式	C BEND	C BEND	-	C BEND	C BEND	C BEND	C BEND	C BEND	C BEND
端子位置	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

BYG26G

BYG26G概述

BYG26G规格参数

文档预览

BYG26G相似产品对比

推荐资源