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HCS169-01TG

产品描述IC Socket, PGA169, 169 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
产品类别连接器    插座   
文件大小261KB,共2页
制造商Advanced Interconnections Corp
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HCS169-01TG概述

IC Socket, PGA169, 169 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

HCS169-01TG规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性2.5 OZ. AVG. INSERTION FORCE
主体宽度1.3 inch
主体深度0.165 inch
主体长度1.3 inch
触点的结构13X13
联系完成配合AU ON NI
联系完成终止Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
触点材料BE-CU
触点样式RND PIN-SKT
设备插槽类型IC SOCKET
使用的设备类型PGA169
外壳材料GLASS FILLED THERMOPLASTIC
JESD-609代码e0
制造商序列号HCS
插接触点节距0.1 inch
安装方式STRAIGHT
触点数169
最高工作温度260 °C
最低工作温度-60 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.1 mm
端子节距2.54 mm
端接类型SOLDER

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PGA Sockets
Table of Models
Low Insertion Force PGA Sockets
.100/(2.54mm) Standard Grid
Description:
Peel-A-Way
®
(KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description:
FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Features:
• Low insertion force (1 oz. average
per pin).
• Screw-machined terminals with
multiple finger contacts for
reliability.
• Closed bottom terminal for 100%
anti-wicking of solder.
• Tapered entry for ease of
insertion.
• Custom designs available.
Description:
Molded (RIS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
RIS replaces HCIS, HCS, CIS, and CS.
?
?
.005
(.13)
PC Board
PC Board
Polyimide
Film
.062
(1.57)
.095
(2.41)
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
1 RIS
Footprint Dash #
If Applicable
*
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
®
068 - 04 M G
Contact Plating
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
FIS - FR-4
RIS - Hi-Temp Molded LCP
Number of Pins
004 to 484
*Footprints available online
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
1 ESX 503 - 234
Footprint Dash #
Body Type
M
G
RoHS Compliant:
Contact Plating
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
If Applicable
*
inch/(mm)
G - Gold
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