HEX 1-BIT DRIVER, INVERTED OUTPUT, PDIP16, PLASTIC, SOT-38-1, DIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e4 |
| 长度 | 21.6 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 1 |
| 功能数量 | 6 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT APPLICABLE |
| 传播延迟（tpd） | 160 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.7 mm |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 933282590652 | 933373410652 | 933373410653 | HEF40098BU | 933378970005 | |
|---|---|---|---|---|---|
| 描述 | HEX 1-BIT DRIVER, INVERTED OUTPUT, PDIP16, PLASTIC, SOT-38-1, DIP-16 | IC HEX 1-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SOT-109-1, SO-16, Bus Driver/Transceiver | IC HEX 1-BIT DRIVER, INVERTED OUTPUT, PDSO16, PLASTIC, SOT-109-1, SO-16, Bus Driver/Transceiver | IC 6-BIT DRIVER, INVERTED OUTPUT, UUC, DIE, Bus Driver/Transceiver | IC HEX 1-BIT DRIVER, INVERTED OUTPUT, UUC, DIE, Bus Driver/Transceiver |
| 零件包装代码 | DIP | SOIC | SOIC | DIE | DIE |
| 包装说明 | DIP, | PLASTIC, SOT-109-1, SO-16 | PLASTIC, SOT-109-1, SO-16 | , | , |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | X-XUUC-N | X-XUUC-N |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | 1 | 1 | 6 | 1 |
| 功能数量 | 6 | 6 | 6 | 1 | 6 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | UNSPECIFIED |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | UNCASED CHIP | UNCASED CHIP |
| 传播延迟（tpd） | 160 ns | 160 ns | 160 ns | 160 ns | 160 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | UPPER | UPPER |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | - |
| 针数 | 16 | 16 | 16 | - | - |
| JESD-609代码 | e4 | e4 | e4 | - | - |
| 长度 | 21.6 mm | 9.9 mm | 9.9 mm | - | - |
| 端子数量 | 16 | 16 | 16 | - | - |
| 封装代码 | DIP | SOP | SOP | - | - |
| 峰值回流温度（摄氏度） | NOT APPLICABLE | 260 | 260 | - | - |
| 座面最大高度 | 4.7 mm | 1.75 mm | 1.75 mm | - | - |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | - | - |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE | 30 | 30 | - | - |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | - | - |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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