IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | National Semiconductor(TI ) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP8,.25 |
针数 | 8 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 0.2 µA |
25C 时的最大偏置电流 (IIB) | 0.1 µA |
最小共模抑制比 | 65 dB |
标称共模抑制比 | 85 dB |
频率补偿 | YES |
最大输入失调电压 | 5000 µV |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e3 |
长度 | 4.9 mm |
低-失调 | NO |
湿度敏感等级 | 1 |
负供电电压上限 | |
标称负供电电压 (Vsup) | |
功能数量 | 2 |
端子数量 | 8 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 |
电源 | +-1.5/+-15/3/30 V |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
标称压摆率 | 0.1 V/us |
最大压摆率 | 2 mA |
供电电压上限 | 32 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
标称均一增益带宽 | 1000 kHz |
最小电压增益 | 25000 |
宽度 | 3.9 mm |
LM358AM/NOPB | LM358H/NOPB | LM358N/NOPB | LM358MX/NOPB | LM358M/NOPB | LM358AMX/NOPB | LM358AN/NOPB | LM358TPX/NOPB | LM358TP/NOPB | |
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描述 | IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier | IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDSO8, SOIC-8, Operational Amplifier | IC DUAL OP-AMP, 5000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier | IC DUAL OP-AMP, 9000 uV OFFSET-MAX, 1 MHz BAND WIDTH, PBGA8, LEAD FREE, MICRO, BUMP, SMD-8, Operational Amplifier |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | SOIC | BCY | DIP | SOIC | SOIC | SOIC | DIP | BGA | BGA |
包装说明 | SOP, SOP8,.25 | TO-5, CAN8,.2 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | FBGA, BGA8,3X3,20 | FBGA, BGA8,3X3,20 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) | 0.2 µA | 0.05 µA | 0.05 µA | 0.05 µA | 0.05 µA | 0.2 µA | 0.2 µA | 0.05 µA | 0.05 µA |
25C 时的最大偏置电流 (IIB) | 0.1 µA | 0.25 µA | 0.25 µA | 0.25 µA | 0.25 µA | 0.1 µA | 0.1 µA | 0.25 µA | 0.25 µA |
标称共模抑制比 | 85 dB | 85 dB | 85 dB | 85 dB | 85 dB | 85 dB | 85 dB | 85 dB | 85 dB |
频率补偿 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
最大输入失调电压 | 5000 µV | 9000 µV | 9000 µV | 9000 µV | 9000 µV | 5000 µV | 5000 µV | 9000 µV | 9000 µV |
JESD-30 代码 | R-PDSO-G8 | O-MBCY-W8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | S-PBGA-B8 | S-PBGA-B8 |
JESD-609代码 | e3 | e1 | e3 | e3 | e3 | e3 | e3 | e1 | e1 |
低-失调 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | METAL | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | TO-5 | DIP | SOP | SOP | SOP | DIP | FBGA | FBGA |
封装等效代码 | SOP8,.25 | CAN8,.2 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 | BGA8,3X3,20 | BGA8,3X3,20 |
封装形状 | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | SMALL OUTLINE | CYLINDRICAL | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
供电电压上限 | 32 V | 32 V | 32 V | 32 V | 32 V | 32 V | 32 V | 32 V | 32 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | NO | YES | YES | YES | NO | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | GULL WING | WIRE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | BALL | BALL |
端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
标称均一增益带宽 | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz | 1000 kHz |
最小电压增益 | 25000 | 25000 | 25000 | 15000 | 15000 | 25000 | 25000 | 15000 | 15000 |
厂商名称 | National Semiconductor(TI ) | - | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
最小共模抑制比 | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB | 65 dB | - | - |
长度 | 4.9 mm | - | 9.817 mm | 4.9 mm | 4.9 mm | 4.9 mm | 9.817 mm | 1.285 mm | 1.285 mm |
座面最大高度 | 1.75 mm | - | 5.08 mm | 1.75 mm | 1.75 mm | 1.75 mm | 5.08 mm | - | - |
标称压摆率 | 0.1 V/us | 0.1 V/us | 0.1 V/us | 0.1 V/us | 0.1 V/us | 0.1 V/us | 0.1 V/us | - | - |
端子节距 | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.5 mm | 0.5 mm |
宽度 | 3.9 mm | - | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 1.285 mm | 1.285 mm |
包装方法 | - | RAIL | RAIL | TAPE AND REEL | RAIL | TAPE AND REEL | RAIL | TAPE AND REEL | TAPE AND REEL |
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