Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QCCN, LCC44,.65SQ |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | 8051 |
| JESD-30 代码 | S-XQCC-N44 |
| JESD-609代码 | e0 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | QCCN |
| 封装等效代码 | LCC44,.65SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 128 |
| ROM（单词） | 4096 |
| ROM可编程性 | UVPROM |
| 筛选级别 | 38535Q/M;38534H;883B |
| 速度 | 12 MHz |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 87C51/BUA/OT | 87C51-16/BQA/OT | 87C51-16/BUA/OT | 80C31BH/BYA | P80CL51HFB | SC80C31BAYA44 | MD80C31BH/B | SC80C31BAYN40 | SC80C51BAYA44 | SC80C51BAYN40 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44 | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDFP52 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PQFP44 | Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, 8051 CPU, 33MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, MROM, 8051 CPU, 33MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, MROM, 8051 CPU, 33MHz, CMOS, PDIP40, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCN, LCC44,.65SQ | DIP, DIP40,.6 | QCCN, LCC44,.65SQ | DFP, FL52,.7 | QFP, QFP44,.5SQ,32 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 代码 | S-XQCC-N44 | R-XDIP-T40 | S-XQCC-N44 | R-XDFP-F52 | S-PQFP-G44 | S-PQCC-J44 | R-XDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 44 | 40 | 44 | 52 | 44 | 44 | 40 | 40 | 44 | 40 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | DIP | QCCN | DFP | QFP | QCCJ | DIP | DIP | QCCJ | DIP |
| 封装等效代码 | LCC44,.65SQ | DIP40,.6 | LCC44,.65SQ | FL52,.7 | QFP44,.5SQ,32 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 1.8/6 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| ROM（单词） | 4096 | 4096 | 4096 | - | 4096 | - | - | - | 4096 | 4096 |
| 速度 | 12 MHz | 16 MHz | 16 MHz | 12 MHz | 16 MHz | 33 MHz | 12 MHz | 33 MHz | 33 MHz | 33 MHz |
| 表面贴装 | YES | NO | YES | YES | YES | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT | GULL WING | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| ROM可编程性 | UVPROM | UVPROM | UVPROM | - | MROM | - | - | - | MROM | MROM |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
为我们提建议&公告
嵌入式系统
模拟电子
机器人开发
无线连接
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
