AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| 其他特性 | BROADSIDE VERSION OF 374 |
| 系列 | AHC |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大频率@ Nom-Sup | 75000000 Hz |
| 最大I（ol） | 0.008 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/5.5 V |
| Prop。Delay @ Nom-Sup | 12 ns |
| 传播延迟（tpd） | 19 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 8.89 mm |
| SN54AHC574FK | SN54AHC574FKR | SN54AHC574WR | SN74AHC574PWLE | SN74AHC574DBLE | SN74AHC574DGV | |
|---|---|---|---|---|---|---|
| 描述 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-TSSOP -40 to 85 | Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-SSOP -40 to 85 | AHC SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, TVSOP-20 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFN | QLCC | DFP | TSSOP | SSOP | SOIC |
| 包装说明 | QCCN, LCC20,.35SQ | QCCN, | DFP, | TSSOP, TSSOP20,.25 | SSOP, SSOP20,.3 | TSSOP, TSSOP20,.25,16 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | not_compliant | unknown |
| 系列 | AHC | AHC | AHC | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC |
| JESD-30 代码 | S-CQCC-N20 | S-CQCC-N20 | R-GDFP-F20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| 长度 | 8.89 mm | 8.89 mm | 13.09 mm | 6.5 mm | 7.2 mm | 5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | QCCN | DFP | TSSOP | SSOP | TSSOP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 19 ns | 19 ns | 19 ns | 19 ns | 19 ns | 19 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 2.03 mm | 2.54 mm | 1.2 mm | 2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | FLAT | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.4 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8.89 mm | 8.89 mm | 6.92 mm | 4.4 mm | 5.3 mm | 4.4 mm |
| 其他特性 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | BROADSIDE VERSION OF 374 | - |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 封装等效代码 | LCC20,.35SQ | - | - | TSSOP20,.25 | SSOP20,.3 | TSSOP20,.25,16 |
stm32/stm8
模拟电子
嵌入式系统
嵌入式系统
51单片机
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
