UV PLD, 40ns, CMOS, CQCC68, WINDOWED, CERAMIC, JLCC-68
| 参数名称 | 属性值 |
| 零件包装代码 | LCC |
| 包装说明 | WQCCJ, |
| 针数 | 68 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 52 MACROCELLS; BURIED MACROCELLS |
| 最大时钟频率 | 25 MHz |
| JESD-30 代码 | S-CQCC-J68 |
| JESD-609代码 | e0 |
| 长度 | 24.15 mm |
| 专用输入次数 | 8 |
| I/O 线路数量 | 52 |
| 端子数量 | 68 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 52 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, WINDOW |
| 可编程逻辑类型 | UV PLD |
| 传播延迟 | 40 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 24.15 mm |
| Base Number Matches | 1 |
| 5962-9324802MXA | 5962-9324802MYA | 5962-9324803MXA | 5962-9324803MYA | |
|---|---|---|---|---|
| 描述 | UV PLD, 40ns, CMOS, CQCC68, WINDOWED, CERAMIC, JLCC-68 | UV PLD, 40ns, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68 | UV PLD, 40ns, CMOS, CQCC68, WINDOWED, CERAMIC, JLCC-68 | UV PLD, 40ns, CMOS, CPGA68, WINDOWED, CERAMIC, PGA-68 |
| 零件包装代码 | LCC | PGA | LCC | PGA |
| 包装说明 | WQCCJ, | WPGA, | WQCCJ, | WPGA, |
| 针数 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | unknow | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 其他特性 | 52 MACROCELLS; BURIED MACROCELLS | 52 MACROCELLS; BURIED MACROCELLS | 52 MACROCELLS; BURIED MACROCELLS | 52 MACROCELLS; BURIED MACROCELLS |
| 最大时钟频率 | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| JESD-30 代码 | S-CQCC-J68 | S-CPGA-P68 | S-CQCC-J68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 24.15 mm | 29.464 mm | 24.15 mm | 29.464 mm |
| 专用输入次数 | 8 | 8 | 8 | 8 |
| I/O 线路数量 | 52 | 52 | 52 | 52 |
| 端子数量 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 52 I/O | 8 DEDICATED INPUTS, 52 I/O | 8 DEDICATED INPUTS, 52 I/O | 8 DEDICATED INPUTS, 52 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQCCJ | WPGA | WQCCJ | WPGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, WINDOW | GRID ARRAY, WINDOW | CHIP CARRIER, WINDOW | GRID ARRAY, WINDOW |
| 可编程逻辑类型 | UV PLD | UV PLD | UV PLD | UV PLD |
| 传播延迟 | 40 ns | 40 ns | 40 ns | 40 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | J BEND | PIN/PEG | J BEND | PIN/PEG |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR |
| 宽度 | 24.15 mm | 29.464 mm | 24.15 mm | 29.464 mm |
| Base Number Matches | 1 | 1 | 1 | - |
| 厂商名称 | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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