EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, SOJ28,.44 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO |
| 最长访问时间 | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-J28 |
| JESD-609代码 | e0 |
| 长度 | 18.415 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | EDO DRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 28 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装等效代码 | SOJ28,.44 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 4096 |
| 座面最大高度 | 3.76 mm |
| 自我刷新 | YES |
| 最大待机电流 | 0.0002 A |
| 最大压摆率 | 0.09 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| KM48V2004ALLJ-6 | KM48V2004ALLT-7 | KM48V2004ALLT-8 | KM48V2004ALLT-6 | KM48V2004ALLTR-7 | KM48V2004ALLTR-8 | KM48V2004ALLJ-8 | KM48V2004ALLTR-6 | KM48V2004ALLJ-7 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | EDO DRAM, 2MX8, 70ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 | EDO DRAM, 2MX8, 80ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 | EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, TSOP2-28 | EDO DRAM, 2MX8, 70ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, REVERSE, TSOP2-28 | EDO DRAM, 2MX8, 80ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, REVERSE, TSOP2-28 | EDO DRAM, 2MX8, 80ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 | EDO DRAM, 2MX8, 60ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, REVERSE, TSOP2-28 | EDO DRAM, 2MX8, 70ns, CMOS, PDSO28, 0.400 INCH, PLASTIC, SOJ-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | SOJ | TSOP | TSOP | TSOP | TSOP | TSOP | SOJ | TSOP | SOJ |
| 包装说明 | SOJ, SOJ28,.44 | TSOP2, TSOP28,.46 | TSOP2, TSOP28,.46 | TSOP2, TSOP28,.46 | TSOP2-R, TSOP28,.46 | TSOP2-R, TSOP28,.46 | SOJ, SOJ28,.44 | TSOP2-R, TSOP28,.46 | SOJ, SOJ28,.44 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
| 最长访问时间 | 60 ns | 70 ns | 80 ns | 60 ns | 70 ns | 80 ns | 80 ns | 60 ns | 70 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-J28 | R-PDSO-G28 | R-PDSO-J28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.415 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.415 mm | 18.41 mm | 18.415 mm |
| 内存密度 | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bi | 16777216 bi |
| 内存集成电路类型 | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM | EDO DRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | TSOP2 | TSOP2 | TSOP2 | TSOP2-R | TSOP2-R | SOJ | TSOP2-R | SOJ |
| 封装等效代码 | SOJ28,.44 | TSOP28,.46 | TSOP28,.46 | TSOP28,.46 | TSOP28,.46 | TSOP28,.46 | SOJ28,.44 | TSOP28,.46 | SOJ28,.44 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
| 座面最大高度 | 3.76 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.76 mm | 1.2 mm | 3.76 mm |
| 自我刷新 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大待机电流 | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A |
| 最大压摆率 | 0.09 mA | 0.08 mA | 0.07 mA | 0.09 mA | 0.08 mA | 0.07 mA | 0.07 mA | 0.09 mA | 0.08 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | J BEND | GULL WING | J BEND |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
淘e淘
stm32/stm8
FPGA/CPLD
嵌入式系统
stm32/stm8
无线连接
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
