Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Harris |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 其他特性 | CLOCK INHIBIT; RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY |
| 计数方向 | RIGHT |
| 系列 | HC/UH |
| JESD-30 代码 | R-CDIP-T16 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN SERIAL OUT |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 传播延迟（tpd） | 41 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535V;38534K;883S |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| 最小 fmax | 20 MHz |
| HCS165DMSR | 5962R9578601V9A | HCS165K/SAMPLE | HCS165HMSR | 5962R9578601VEC | HCS165D/SAMPLE | HCS165KMSR | |
|---|---|---|---|---|---|---|---|
| 描述 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDIP16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDFP16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDIP16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDIP16 | Parallel In Serial Out, HC/UH Series, 8-Bit, Right Direction, Complementary Output, CMOS, CDFP16 |
| 包装说明 | DIP, DIP16,.3 | DIE, | , | DIE, | , | , | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown |
| 计数方向 | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT | RIGHT |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-CDIP-T16 | X-XUUC-N16 | R-CDFP-F16 | X-XUUC-N16 | R-CDIP-T16 | R-CDIP-T16 | R-CDFP-F16 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT | PARALLEL IN SERIAL OUT |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | UNCASED CHIP | FLATPACK | UNCASED CHIP | IN-LINE | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 41 ns | 41 ns | 41 ns | 41 ns | 41 ns | 41 ns | 41 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子位置 | DUAL | UPPER | DUAL | UPPER | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 厂商名称 | Harris | - | Harris | Harris | Harris | Harris | Harris |
| JESD-609代码 | e0 | e0 | - | - | e4 | - | e0 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | - | -55 °C |
| 封装代码 | DIP | DIE | - | DIE | - | - | DFP |
| 温度等级 | MILITARY | MILITARY | - | MILITARY | MILITARY | - | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | - | - | GOLD | - | Tin/Lead (Sn/Pb) |
Microchip MCU
stm32/stm8
电源技术
嵌入式系统
无线连接
stm32/stm8
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