Switching Regulator/Controller, Voltage-mode, 0.02A, 100kHz Switching Freq-Max, BIPolar, CDIP8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| SE5561FE-B | CAR2024FPB-1A | CAR2024FPBY0-1A | CAR2024FP | NE556-1F-B | NE5561FE-B | NE5561N(SMPS) | SE556-1F-B | SE556-1CF | SE556-1CN | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Switching Regulator/Controller, Voltage-mode, 0.02A, 100kHz Switching Freq-Max, BIPolar, CDIP8 | 2000 Watt 24V Front End Power Supply | 2000 Watt 24V Front End Power Supply | 2000 Watt 24V Front End Power Supply | Analog Waveform Generation Function, BIPolar, CDIP14 | Switching Regulator/Controller, Voltage-mode, 0.02A, 100kHz Switching Freq-Max, BIPolar, CDIP8 | Switching Regulator/Controller, Voltage-mode, 0.02A, 100kHz Switching Freq-Max, BIPolar, PDIP8 | Analog Waveform Generation Function, BIPolar, CDIP14 | Analog Waveform Generation Function, BIPolar, CDIP14, | Analog Waveform Generation Function, BIPolar, PDIP14, |
| 是否Rohs认证 | 不符合 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown | - | - | - | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | - | - | - | - | R-XDIP-T14 | R-XDIP-T8 | R-PDIP-T8 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609代码 | - | - | - | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | - | - | - | - | 14 | 8 | 8 | 14 | 14 | 14 |
| 最高工作温度 | - | - | - | - | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 封装主体材料 | - | - | - | - | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | - | - | - | - | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | - | - | - | - | DIP14,.3 | DIP8,.3 | DIP8,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | - | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 表面贴装 | - | - | - | - | NO | NO | NO | NO | NO | NO |
| 技术 | - | - | - | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | - | - | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | - | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | - | - | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | - | - | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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