Dual 2-input NOR gate
74LVC2G02_08 | 74LVC2G02 | 74LVC2G02GT | 74LVC2G02DC | 74LVC2G02GD | 74LVC2G02DP | 74LVC2G02GM | |
---|---|---|---|---|---|---|---|
描述 | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate | Dual 2-input NOR gate |
是否Rohs认证 | - | - | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
零件包装代码 | - | - | SON | TSSOP | SON | SOIC | QFN |
包装说明 | - | - | 1 X 1.95 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-252, SOT833-1, SON-8 | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | 3 X 2 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, SOT996-2, SON-8 | 3 MM, PLASTIC, SOT505-2, TSSOP-8 | 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, PLASTIC, MO-255, SOT902-1, QFN-8 |
针数 | - | - | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | - | - | compli | compli | compli | compli | compli |
系列 | - | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | - | - | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-N8 | S-PDSO-G8 | S-PQCC-N8 |
JESD-609代码 | - | - | e3 | e4 | e4 | e4 | e4 |
长度 | - | - | 1.95 mm | 2.3 mm | 3 mm | 3 mm | 1.6 mm |
负载电容(CL) | - | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | - | - | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
最大I(ol) | - | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
湿度敏感等级 | - | - | 1 | 1 | 1 | 1 | 1 |
功能数量 | - | - | 2 | 2 | 2 | 2 | 2 |
输入次数 | - | - | 2 | 2 | 2 | 2 | 2 |
端子数量 | - | - | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | - | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | VSON | VSSOP | VSON | TSSOP | HVQCCN |
封装等效代码 | - | - | SOLCC8,.04,20 | TSSOP8,.12,20 | SOLCC8,.11,20 | TSSOP8,.16 | LCC8,.06SQ,20 |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | - | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
包装方法 | - | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
峰值回流温度(摄氏度) | - | - | 260 | 260 | 260 | 260 | 260 |
电源 | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Prop。Delay @ Nom-Su | - | - | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns |
传播延迟(tpd) | - | - | 11.2 ns | 11.2 ns | 11.2 ns | 11.2 ns | 11.2 ns |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | - | - | NO | NO | NO | NO | NO |
座面最大高度 | - | - | 0.5 mm | 1 mm | 0.5 mm | 1.1 mm | 0.5 mm |
最大供电电压 (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
标称供电电压 (Vsup) | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | - | YES | YES | YES | YES | YES |
技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | - | - | Tin (Sn) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
端子形式 | - | - | NO LEAD | GULL WING | NO LEAD | GULL WING | NO LEAD |
端子节距 | - | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm |
端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | - | - | 30 | 30 | 30 | 30 | 30 |
宽度 | - | - | 1 mm | 2 mm | 2 mm | 3 mm | 1.6 mm |
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