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74HC238BQ: 产品描述HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16; 产品类别逻辑逻辑; 文件大小97KB，共18页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74HC238BQ概述

HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16

HC/UH系列, 其他解码器/驱动器, 实输出, PDSO16

74HC238BQ规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	QFN
包装说明	HVQCCN, LCC16/20,.14X.16,20
针数	16
Reach Compliance Code	compli
ECCN代码	EAR99
系列	HC/UH
输入调节	STANDARD
JESD-30 代码	R-PQCC-N16
JESD-609代码	e4
长度	3.5 mm
负载电容（CL）	50 pF
逻辑集成电路类型	OTHER DECODER/DRIVER
最大I（ol）	0.004 A
湿度敏感等级	1
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-40 °C
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	HVQCCN
封装等效代码	LCC16/20,.14X.16,20
封装形状	RECTANGULAR
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）	260
电源	2/6 V
Prop。Delay @ Nom-Su	45 ns
传播延迟（tpd）	45 ns
认证状态	Not Qualified
座面最大高度	1 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30
宽度	2.5 mm
Base Number Matches	1

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74HC238; 74HCT238

3-to-8 line decoder/demultiplexer

Rev. 03 — 16 July 2007

Product data sheet

1. General description

74HC238 and 74HCT238 are high-speed Si-gate CMOS devices and are pin compatible

with Low-Power Schottky TTL (LSTTL).

The 74HC238/74HCT238 decoders accept three binary weighted address inputs (A0, A1,

A2) and when enabled, provide 8 mutually exclusive active HIGH outputs (Y0 to Y7). The

74HC238/74HCT238 features three enable inputs: two active LOW (E1 and E2) and one

active HIGH (E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH.

This multiple enable function allows easy parallel expansion of the “238” to a 1-to-32 (5

lines to 32 lines) decoder with just four “238” ICs and one inverter. The “238” can be used

as an eight output demultiplexer by using one of the active LOW enable inputs as the data

input and the remaining enable inputs as strobes. Unused enable inputs must be

permanently tied to their appropriate active HIGH or LOW state.

The 74HC238/74HCT238 is similar to the 74HC138/74HCT138 but has non-inverting

outputs.

2. Features

Demultiplexing capability

Multiple input enable for easy expansion

Ideal for memory chip select decoding

Active HIGH mutually exclusive outputs

Multiple package options

Complies with JEDEC standard no. 7A

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

Speciﬁed from

−40 °C

to +85

°C

and from

−40 °C

to +125

°C

74HC238BQ相似产品对比

	74HC238BQ	74HC238	74HC238N	74HCT238BQ	74HCT238	74HCT238N
描述	HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16	HC/UH SERIES, OTHER DECODER/DRIVER, TRUE OUTPUT, PDSO16
系列	HC/UH	HC/UH	HC/UH	HCT	HC/UH	HCT
功能数量	1	1	1	1	1	1
端子数量	16	16	16	16	16	16
输出极性	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
表面贴装	YES	Yes	NO	YES	Yes	NO
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	NO LEAD	GULL WING	THROUGH-HOLE	NO LEAD	GULL WING	THROUGH-HOLE
端子位置	QUAD	双	DUAL	QUAD	双	DUAL
是否无铅	不含铅	-	不含铅	不含铅	-	不含铅
是否Rohs认证	符合	-	符合	符合	-	符合
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	-	NXP(恩智浦)
零件包装代码	QFN	-	DIP	QFN	-	DIP
包装说明	HVQCCN, LCC16/20,.14X.16,20	-	DIP, DIP16,.3	HVQCCN, LCC16/20,.14X.16,20	-	DIP, DIP16,.3
针数	16	-	16	16	-	16
Reach Compliance Code	compli	-	unknow	compli	-	unknow
输入调节	STANDARD	-	STANDARD	STANDARD	-	STANDARD
JESD-30 代码	R-PQCC-N16	-	R-PDIP-T16	R-PQCC-N16	-	R-PDIP-T16
JESD-609代码	e4	-	e4	e4	-	e4
长度	3.5 mm	-	21.6 mm	3.5 mm	-	21.6 mm
负载电容（CL）	50 pF	-	50 pF	50 pF	-	50 pF
逻辑集成电路类型	OTHER DECODER/DRIVER	-	OTHER DECODER/DRIVER	OTHER DECODER/DRIVER	-	OTHER DECODER/DRIVER
最大I（ol）	0.004 A	-	0.004 A	0.004 A	-	0.004 A
最高工作温度	125 °C	-	125 °C	125 °C	-	125 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-	-40 °C
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	HVQCCN	-	DIP	HVQCCN	-	DIP
封装等效代码	LCC16/20,.14X.16,20	-	DIP16,.3	LCC16/20,.14X.16,20	-	DIP16,.3
封装形状	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	IN-LINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	-	IN-LINE
峰值回流温度（摄氏度）	260	-	NOT SPECIFIED	260	-	NOT SPECIFIED
电源	2/6 V	-	2/6 V	5 V	-	5 V
Prop。Delay @ Nom-Su	45 ns	-	45 ns	53 ns	-	53 ns
传播延迟（tpd）	45 ns	-	45 ns	53 ns	-	53 ns
认证状态	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified
座面最大高度	1 mm	-	4.7 mm	1 mm	-	4.7 mm
最大供电电压 (Vsup)	6 V	-	6 V	5.5 V	-	5.5 V
最小供电电压 (Vsup)	2 V	-	2 V	4.5 V	-	4.5 V
标称供电电压 (Vsup)	5 V	-	5 V	5 V	-	5 V
技术	CMOS	-	CMOS	CMOS	-	CMOS
端子面层	NICKEL PALLADIUM GOLD	-	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	-	Nickel/Palladium/Gold (Ni/Pd/Au)
端子节距	0.5 mm	-	2.54 mm	0.5 mm	-	2.54 mm
处于峰值回流温度下的最长时间	30	-	NOT SPECIFIED	30	-	NOT SPECIFIED
宽度	2.5 mm	-	7.62 mm	2.5 mm	-	7.62 mm
Base Number Matches	1	-	1	1	-	1

74HC238BQ

74HC238BQ概述

74HC238BQ规格参数

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