Memory Circuit, Flash+PSRAM, CMOS, PBGA84
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | AMD(超微) |
包装说明 | FBGA, BGA84,10X12,32 |
Reach Compliance Code | compliant |
最长访问时间 | 110 ns |
JESD-30 代码 | R-PBGA-B84 |
内存集成电路类型 | MEMORY CIRCUIT |
混合内存类型 | FLASH+PSRAM |
端子数量 | 84 |
最高工作温度 | 85 °C |
最低工作温度 | -25 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FBGA |
封装等效代码 | BGA84,10X12,32 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH |
电源 | 1.8/3,3 V |
认证状态 | Not Qualified |
最大待机电流 | 0.005 A |
最大压摆率 | 0.09 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
S71GS256NC0BAWAK2 | S71GS128NB0BAWAK0 | S71GS256NC0BFWAP2 | S71GS256NC0BAWAP3 | S71GS256NC0BFWAK0 | S71GS256NC0BFWAP3 | S71GS128NB0BFWAP3 | |
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描述 | Memory Circuit, Flash+PSRAM, CMOS, PBGA84 | Memory Circuit, Flash+PSRAM, CMOS, PBGA84 | Memory Circuit, Flash+PSRAM, CMOS, PBGA84 | Memory Circuit, Flash+PSRAM, CMOS, PBGA84 | Memory Circuit, Flash+PSRAM, CMOS, PBGA84 | Memory Circuit, Flash+PSRAM, CMOS, PBGA84 | Memory Circuit, Flash+PSRAM, CMOS, PBGA84 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
包装说明 | FBGA, BGA84,10X12,32 | FBGA, BGA84,10X12,32 | FBGA, BGA84,10X12,32 | FBGA, BGA84,10X12,32 | FBGA, BGA84,10X12,32 | FBGA, BGA84,10X12,32 | FBGA, BGA84,10X12,32 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
最长访问时间 | 110 ns | 110 ns | 110 ns | 110 ns | 110 ns | 110 ns | 110 ns |
JESD-30 代码 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 | R-PBGA-B84 |
内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
混合内存类型 | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM |
端子数量 | 84 | 84 | 84 | 84 | 84 | 84 | 84 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
封装等效代码 | BGA84,10X12,32 | BGA84,10X12,32 | BGA84,10X12,32 | BGA84,10X12,32 | BGA84,10X12,32 | BGA84,10X12,32 | BGA84,10X12,32 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
电源 | 1.8/3,3 V | 1.8/3,3 V | 1.8/3,3 V | 1.8/3,3 V | 1.8/3,3 V | 1.8/3,3 V | 1.8/3,3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
最大压摆率 | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA | 0.09 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
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