Dual-bit, dual-supply voltage level translator/transceiver; 3-state
| 74AVC2T45_09 | 74AVC2T45DP | 74AVC2T45DC | 74AVC2T45 | 74AVC2T45GD | 74AVC2T45GT | |
|---|---|---|---|---|---|---|
| 描述 | Dual-bit, dual-supply voltage level translator/transceiver; 3-state | Dual-bit, dual-supply voltage level translator/transceiver; 3-state | Dual-bit, dual-supply voltage level translator/transceiver; 3-state | Dual-bit, dual-supply voltage level translator/transceiver; 3-state | Dual-bit, dual-supply voltage level translator/transceiver; 3-state | Dual-bit, dual-supply voltage level translator/transceiver; 3-state |
| 是否Rohs认证 | - | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | - | SOIC | TSSOP | - | SON | SON |
| 包装说明 | - | TSSOP, TSSOP8,.16 | 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 | - | VSON, SOLCC8,.12,20 | 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8 |
| 针数 | - | 8 | 8 | - | 8 | 8 |
| Reach Compliance Code | - | compli | compli | - | compli | compli |
| 控制类型 | - | COMMON CONTROL | COMMON CONTROL | - | COMMON CONTROL | COMMON CONTROL |
| 计数方向 | - | BIDIRECTIONAL | BIDIRECTIONAL | - | BIDIRECTIONAL | BIDIRECTIONAL |
| 系列 | - | AVC | AVC | - | AVC | AVC |
| JESD-30 代码 | - | S-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-N8 | R-PDSO-N8 |
| 长度 | - | 3 mm | 2.3 mm | - | 3 mm | 1.95 mm |
| 逻辑集成电路类型 | - | BUS TRANSCEIVER | BUS TRANSCEIVER | - | BUS TRANSCEIVER | BUS TRANSCEIVER |
| 最大I（ol） | - | 0.006 A | 0.006 A | - | 0.006 A | 0.006 A |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | 1 |
| 位数 | - | 2 | 2 | - | 2 | 2 |
| 功能数量 | - | 1 | 1 | - | 1 | 1 |
| 端口数量 | - | 2 | 2 | - | 2 | 2 |
| 端子数量 | - | 8 | 8 | - | 8 | 8 |
| 最高工作温度 | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | VSSOP | - | VSON | VSON |
| 封装等效代码 | - | TSSOP8,.16 | TSSOP8,.12,20 | - | SOLCC8,.12,20 | SOLCC8,.04,20 |
| 封装形状 | - | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | - | 260 | 260 | - | 260 | 260 |
| 电源 | - | 1.2/3.3 V | 1.2/3.3 V | - | 1.2/3.3 V | 1.2/3.3 V |
| 传播延迟（tpd） | - | 9.9 ns | 9.9 ns | - | 9.9 ns | 9.9 ns |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.1 mm | 1 mm | - | 0.5 mm | 0.5 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 0.8 V | 0.8 V | - | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | - | 1.1 V | 1.1 V | - | 1.1 V | 1.1 V |
| 表面贴装 | - | YES | YES | - | YES | YES |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | - | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) |
| 端子形式 | - | GULL WING | GULL WING | - | NO LEAD | NO LEAD |
| 端子节距 | - | 0.65 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | - | 30 | 30 |
| 翻译 | - | 1.5/3.3V&1.5/3.3V | 1.5/3.3V&1.5/3.3V | - | 1.5/3.3V&1.5/3.3V | 1.5/3.3V&1.5/3.3V |
| 宽度 | - | 3 mm | 2 mm | - | 2 mm | 1 mm |
| Base Number Matches | - | 1 | 1 | - | 1 | 1 |
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