Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SHARP |
| 包装说明 | LQFP, QFP100,.7X1.0 |
| Reach Compliance Code | unknown |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 8 |
| CPU系列 | SM85 |
| DAC 通道 | YES |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e0 |
| I/O 线路数量 | 52 |
| 端子数量 | 100 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -20 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP100,.7X1.0 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 2048 |
| ROM(单词) | 49152 |
| ROM可编程性 | MROM |
| 速度 | 6 MHz |
| 最大压摆率 | 20 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULLWING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| SM8505(QFP) | SM8502(LQFP) | SM8502(QFP) | SM8503(LQFP) | SM8503(QFP) | SM8505(LQFP) | |
|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, | Microcontroller, 8-Bit, MROM, SM85 CPU, 6MHz, PQFP100, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | SM85 | SM85 | SM85 | SM85 | SM85 | SM85 |
| JESD-30 代码 | R-PQFP-G100 | S-PQFP-G100 | R-PQFP-G100 | S-PQFP-G100 | R-PQFP-G100 | S-PQFP-G100 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 100 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | QFP | QFP | QFP | QFP | LFQFP |
| 封装等效代码 | QFP100,.7X1.0 | QFP100,.63SQ,20 | QFP100,.7X1.0 | QFP100,.63SQ,20 | QFP100,.7X1.0 | QFP100,.63SQ,20 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH |
| 电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 2048 | 1024 | 1024 | 1024 | 1024 | 2048 |
| ROM(单词) | 49152 | 24576 | 24576 | 32768 | 32768 | 49152 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM |
| 速度 | 6 MHz | 6 MHz | 6 MHz | 6 MHz | 6 MHz | 6 MHz |
| 最大压摆率 | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULLWING | GULL WING | GULL WING | GULL WING | GULL WING | GULLWING |
| 端子节距 | 0.65 mm | 0.5 mm | 0.635 mm | 0.5 mm | 0.635 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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