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74AHC1G125GF

产品描述Bus buffer/line driver; 3-state
产品类别逻辑    逻辑   
文件大小78KB,共16页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

74AHC1G125GF概述

Bus buffer/line driver; 3-state

74AHC1G125GF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SON
包装说明1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
针数6
Reach Compliance Codeunknow
系列AHC/VHC/H/U/V
JESD-30 代码S-PDSO-N6
JESD-609代码e3
长度1 mm
逻辑集成电路类型BUS DRIVER
湿度敏感等级1
位数1
功能数量1
端口数量2
端子数量6
最高工作温度125 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码VSON
封装形状SQUARE
封装形式SMALL OUTLINE, VERY THIN PROFILE
峰值回流温度(摄氏度)260
传播延迟(tpd)14.5 ns
认证状态Not Qualified
座面最大高度0.5 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)2 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子面层PURE TIN
端子形式NO LEAD
端子节距0.35 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度1 mm

文档预览

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74AHC1G125; 74AHCT1G125
Bus buffer/line driver; 3-state
Rev. 09 — 22 June 2009
Product data sheet
1. General description
74AHC1G125 and 74AHCT1G125 are high-speed Si-gate CMOS devices. They provide
one non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by
the output enable input (OE). A HIGH at OE causes the output to assume a
high-impedance OFF-state.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
I
I
I
I
I
I
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
Multiple package options
ESD protection:
N
HBM JESD22-A114E: exceeds 2000 V
N
MM JESD22-A115-A: exceeds 200 V
N
CDM JESD22-C101C: exceeds 1000 V
I
Specified from
−40 °C
to +125
°C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74AHC1G125GW
74AHCT1G125GW
74AHC1G125GV
74AHCT1G125GV
74AHC1G125GM
74AHCT1G125GM
74AHC1G125GF
74AHCT1G125GF
−40 °C
to +125
°C
XSON6
−40 °C
to +125
°C
XSON6
plastic extremely thin small outline package; no SOT886
leads; 6 terminals; body 1
×
1.45
×
0.5 mm
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
×
1
×
0.5 mm
SOT891
−40 °C
to +125
°C
SC-74A
−40 °C
to +125
°C
Name
TSSOP5
Description
plastic thin shrink small outline package;
5 leads; body width 1.25 mm
plastic surface-mounted package; 5 leads
Version
SOT353-1
SOT753
Type number

74AHC1G125GF相似产品对比

74AHC1G125GF 74AHC1G125 74AHC1G125GW 74AHC1G125GM 74AHCT1G125GF 74AHCT1G125 74AHCT1G125GM 74AHCT1G125GW
描述 Bus buffer/line driver; 3-state Bus buffer/line driver; 3-state AHC/VHC/H/U/V SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5 Bus buffer/line driver; 3-state Bus buffer/line driver; 3-state Bus buffer/line driver; 3-state Bus buffer/line driver; 3-state AHCT/VHCT/VT SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5
是否无铅 不含铅 - 不含铅 不含铅 不含铅 - 不含铅 不含铅
是否Rohs认证 符合 - 符合 符合 符合 - 符合 符合
厂商名称 NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - NXP(恩智浦) NXP(恩智浦)
零件包装代码 SON - TSSOT SON SON - SON TSSOT
包装说明 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6 - TSSOP, TSSOP5/6,.08 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6 - 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5
针数 6 - 5 6 6 - 6 5
Reach Compliance Code unknow - compli unknown unknow - unknow compli
系列 AHC/VHC/H/U/V - AHC/VHC/H/U/V AHC/VHC/H/U/V AHCT/VHCT/VT - AHCT/VHCT/VT AHCT/VHCT/VT
JESD-30 代码 S-PDSO-N6 - R-PDSO-G5 R-PDSO-N6 S-PDSO-N6 - R-PDSO-N6 R-PDSO-G5
JESD-609代码 e3 - e3 e3 e3 - e3 e3
长度 1 mm - 2.05 mm 1.45 mm 1 mm - 1.45 mm 2.05 mm
逻辑集成电路类型 BUS DRIVER - BUS DRIVER BUS DRIVER BUS DRIVER - BUS DRIVER BUS DRIVER
湿度敏感等级 1 - 1 1 1 - 1 1
位数 1 - 1 1 1 - 1 1
功能数量 1 - 1 1 1 - 1 1
端口数量 2 - 2 2 2 - 2 2
端子数量 6 - 5 6 6 - 6 5
最高工作温度 125 °C - 125 °C 125 °C 125 °C - 125 °C 125 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C - -40 °C -40 °C
输出特性 3-STATE - 3-STATE 3-STATE 3-STATE - 3-STATE 3-STATE
输出极性 TRUE - TRUE TRUE TRUE - TRUE TRUE
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VSON - TSSOP VSON VSON - VSON TSSOP
封装形状 SQUARE - RECTANGULAR RECTANGULAR SQUARE - RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE - SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 260 - 260 260 260 - 260 260
传播延迟(tpd) 14.5 ns - 14.5 ns 14.5 ns 9.5 ns - 9.5 ns 9.5 ns
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
座面最大高度 0.5 mm - 1.1 mm 0.5 mm 0.5 mm - 0.5 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V
最小供电电压 (Vsup) 2 V - 2 V 2 V 4.5 V - 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V - 5 V 5 V 5 V - 5 V 5 V
表面贴装 YES - YES YES YES - YES YES
技术 CMOS - CMOS CMOS CMOS - CMOS CMOS
温度等级 AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE AUTOMOTIVE
端子面层 PURE TIN - Tin (Sn) PURE TIN PURE TIN - TIN Tin (Sn)
端子形式 NO LEAD - GULL WING NO LEAD NO LEAD - NO LEAD GULL WING
端子节距 0.35 mm - 0.65 mm 0.5 mm 0.35 mm - 0.5 mm 0.65 mm
端子位置 DUAL - DUAL DUAL DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 30 - 30 30 30 - 30 30
宽度 1 mm - 1.25 mm 1 mm 1 mm - 1 mm 1.25 mm

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