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CM1203-02CP: 产品描述Trans Voltage Suppressor Diode, Unidirectional, 2 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4; 产品类别分立半导体二极管; 文件大小239KB，共7页; 制造商California Micro Devices; 标准

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CM1203-02CP概述

Trans Voltage Suppressor Diode, Unidirectional, 2 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4

CM1203-02CP规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	California Micro Devices
零件包装代码	CSP
包装说明	R-PBGA-B4
针数	4
Reach Compliance Code	unknown
ECCN代码	EAR99
配置	COMMON BIPOLAR TERMINAL, 2 ELEMENTS
二极管元件材料	SILICON
二极管类型	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码	R-PBGA-B4
JESD-609代码	e1
湿度敏感等级	1
元件数量	2
端子数量	4
封装主体材料	PLASTIC/EPOXY
封装形状	RECTANGULAR
封装形式	GRID ARRAY
峰值回流温度（摄氏度）	250
极性	UNIDIRECTIONAL
最大功率耗散	0.2 W
认证状态	Not Qualified
表面贴装	YES
技术	AVALANCHE
端子面层	TIN SILVER COPPER
端子形式	BALL
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED

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CM1203

1, 2 and 3-Channel ESD Arrays in CSP

Features

•

Functionally and pin compatible with CMD’s

CSPESD301/302/303 family of devices

OptiGuard

™

coated for improved reliability at

assembly

1, 2 or 3 channels of ESD protection

±15kV ESD protection (IEC 61000-4-2, contact

discharge)

±30kV ESD protection (HBM)

Supports both AC and DC signal applications

Low leakage current (<100nA)

Chip Scale Package features extremely low lead

inductance for optimum ESD and filter perfor-

mance

4 bump, 1.06 x 0.93mm footprint Chip Scale Pack-

age (CSP)

Lead-free version available

Product Description

The CM1203 comprises a family of 1, 2, and 3-channel

ESD protection arrays, which integrate two, three and

four identical avalanche-style diodes. It is intended that

one of these diodes is connected to GND and the other

diodes provide ESD protection for up to 3 lines

depending upon the configuration utilized. The back-

to-back diode connections provide ESD protection for

nodes that have AC signals up to 5.9V peak. These

devices provide a very high level of protection for sen-

sitive electronic components that may be subjected to

electrostatic discharge (ESD).

The diodes are

designed and characterized to safely dissipate ESD

strikes of ±15kV, well beyond the maximum require-

ments of the IEC 61000-4-2 international standard.

Using the MIL-STD-883 (Method 3015) specification

for Human Body Model (HBM) ESD, these devices pro-

tect against contact discharges of greater than ±30kV.

The diodes also provide some EMI filtering, when used

in combination with a PCB trace or series resistor.

These devices are particularly well-suited for portable

electronics (e.g. cellular telephones, PDAs, notebook

computers) because of their small package format and

easy-to-use pin assignments.

The CM1203 incorporates OptiGuard

™

coating which

results in improved reliability at assembly. The CM1203

is available in a space-saving, low-profile, chip-scale

package with optional lead-free finishing.

•

Applications

•

I/O port protection

EMI filtering for data ports

Cellphones, notebook computers, PDAs

Wireless Handsets

MP3 Players

Digital Still Cameras

Handheld PCs

Electrical Schematics

CM1203-01

CM1203-02

CM1203-03

06/28/04

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

●

Tel: 408.263.3214

●

Fax: 408.263.7846

●

www.calmicro.com

CM1203-02CP相似产品对比

	CM1203-02CP	CM1203-01CP	CM1203-03CS	CM1203-03CP	CM1203-01CS	CM1203-02CS
描述	Trans Voltage Suppressor Diode, Unidirectional, 2 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4	Trans Voltage Suppressor Diode, Unidirectional, 1 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4	Trans Voltage Suppressor Diode, Unidirectional, 3 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4	Trans Voltage Suppressor Diode, Unidirectional, 3 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4	Trans Voltage Suppressor Diode, Unidirectional, 1 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4	Trans Voltage Suppressor Diode, Unidirectional, 2 Element, Silicon, 1.06 X 0.93 MM, 0.670 MM HEIGHT, CSP-4
是否Rohs认证	符合	符合	不符合	符合	不符合	不符合
厂商名称	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices
零件包装代码	CSP	CSP	CSP	CSP	CSP	CSP
包装说明	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4
针数	4	4	4	4	4	4
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
配置	COMMON BIPOLAR TERMINAL, 2 ELEMENTS	SINGLE	COMMON BIPOLAR TERMINAL, 3 ELEMENTS	COMMON BIPOLAR TERMINAL, 3 ELEMENTS	SINGLE	COMMON BIPOLAR TERMINAL, 2 ELEMENTS
二极管元件材料	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON
二极管类型	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE	TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4	R-PBGA-B4
JESD-609代码	e1	e1	e0	e1	e0	e0
元件数量	2	1	3	3	1	2
端子数量	4	4	4	4	4	4
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
峰值回流温度（摄氏度）	250	250	220	250	220	220
极性	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL	UNIDIRECTIONAL
最大功率耗散	0.2 W	0.2 W	0.2 W	0.2 W	0.2 W	0.2 W
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	YES	YES	YES	YES	YES
技术	AVALANCHE	AVALANCHE	AVALANCHE	AVALANCHE	AVALANCHE	AVALANCHE
端子面层	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD	TIN SILVER COPPER	TIN LEAD	TIN LEAD
端子形式	BALL	BALL	BALL	BALL	BALL	BALL
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

CM1203-02CP

CM1203-02CP概述

CM1203-02CP规格参数

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