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IDT72V251L15J

产品描述FIFO, 8KX9, 10ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32
产品类别存储    存储   
文件大小114KB,共14页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT72V251L15J概述

FIFO, 8KX9, 10ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32

IDT72V251L15J规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFJ
包装说明PLASTIC, LCC-32
针数32
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间10 ns
最大时钟频率 (fCLK)66.7 MHz
周期时间15 ns
JESD-30 代码R-PQCC-J32
JESD-609代码e0
长度13.9954 mm
内存密度73728 bit
内存集成电路类型OTHER FIFO
内存宽度9
湿度敏感等级1
功能数量1
端子数量32
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织8KX9
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码QCCJ
封装等效代码LDCC32,.5X.6
封装形状RECTANGULAR
封装形式CHIP CARRIER
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源3.3 V
认证状态Not Qualified
座面最大高度3.55 mm
最大待机电流0.005 A
最大压摆率0.02 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式J BEND
端子节距1.27 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度11.4554 mm

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3.3 VOLT CMOS SyncFIFO™
256 x 9, 512 x 9,
1,024 x 9, 2,048 x 9,
4,096 x 9 and 8,192 x 9
IDT72V201, IDT72V211
IDT72V221, IDT72V231
IDT72V241, IDT72V251
FEATURES:
256 x 9-bit organization IDT72V201
512 x 9-bit organization IDT72V211
1,024 x 9-bit organization IDT72V221
2,048 x 9-bit organization IDT72V231
4,096 x 9-bit organization IDT72V241
8,192 x 9-bit organization IDT72V251
10 ns read/write cycle time
5V input tolerant
Read and Write clocks can be independent
Dual-Ported zero fall-through time architecture
Empty and Full Flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags can be set to
any depth
Programmable Almost-Empty and Almost-Full flags default to
Empty+7, and Full-7, respectively
Output Enable puts output data bus in high-impedance state
Advanced submicron CMOS technology
Available in 32-pin plastic leaded chip carrier (PLCC) and 32-pin
plastic Thin Quad FlatPack (TQFP)
Industrial temperature range (–40°C to +85°C) is available
°
°
DESCRIPTION:
The IDT72V201/72V211/72V221/72V231/72V241/72V251 SyncFIFOs™
are very high-speed, low-power First-In, First-Out (FIFO) memories with
clocked read and write controls. The architecture, functional operation and pin
assignments are identical to those of the IDT72201/72211/72221/72231/
72241/72251, but operate at a power supply voltage (Vcc) between 3.0V and
3.6V. These devices have a 256, 512, 1,024, 2,048, 4,096 and 8,192 x 9-bit
memory array, respectively. These FIFOs are applicable for a wide variety of
data buffering needs such as graphics, local area networks and interprocessor
communication.
These FIFOs have 9-bit input and output ports. The input port is
controlled by a free-running clock (WCLK), and two Write Enable pins
(WEN1, WEN2). Data is written into the Synchronous FIFO on every rising
clock edge when the Write Enable pins are asserted. The output port is
controlled by another clock pin (RCLK) and two Read Enable pins (REN1,
REN2).
The Read Clock can be tied to the Write Clock for single clock
operation or the two clocks can run asynchronous of one another for dual-
clock operation. An Output Enable pin (OE) is provided on the read port
for three-state control of the output.
The Synchronous FIFOs have two fixed flags, Empty (EF) and Full (FF).
Two programmable flags, Almost-Empty (PAE) and Almost-Full (PAF), are
provided for improved system control. The programmable flags default to
Empty+7 and Full-7 for
PAE
and
PAF,
respectively. The programmable flag
offset loading is controlled by a simple state machine and is initiated by asserting
the Load pin (LD).
These FIFOs are fabricated using IDT's high-speed submicron CMOS
technology.
FUNCTIONAL BLOCK DIAGRAM
WCLK
WEN1
WEN2
INPUT REGISTER
OFFSET REGISTER
EF
PAE
PAF
FF
D
0
- D
8
LD
WRITE CONTROL
LOGIC
RAM ARRAY
256 x 9, 512 x 9,
1,024 x 9, 2,048 x 9,
4,096 x 9, 8,192 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
OUTPUT REGISTER
RESET LOGIC
RCLK
REN1
REN2
RS
OE
Q
0
- Q
8
4092 drw 01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. SyncFIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©2002
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
FEBRUARY 2002
DSC-4092/2

IDT72V251L15J相似产品对比

IDT72V251L15J IDT72V241L20J IDT72V251L10PF IDT72V211L10PF IDT72V211L15JI IDT72V201L20PF IDT72V251L15JI IDT72V251L10J IDT72V251L15PF IDT72V211L20J
描述 FIFO, 8KX9, 10ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 4KX9, 12ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 8KX9, 6.5ns, Synchronous, CMOS, PQFP32, PLASTIC, TQFP-32 FIFO, 512X9, 6.5ns, Synchronous, CMOS, PQFP32, PLASTIC, TQFP-32 FIFO, 512X9, 10ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 256X9, 12ns, Synchronous, CMOS, PQFP32, PLASTIC, TQFP-32 FIFO, 8KX9, 10ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 8KX9, 6.5ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32 FIFO, 8KX9, 10ns, Synchronous, CMOS, PQFP32, PLASTIC, TQFP-32 FIFO, 512X9, 12ns, Synchronous, CMOS, PQCC32, PLASTIC, LCC-32
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 QFJ QFJ QFP QFP QFJ QFP QFJ QFJ QFP QFJ
包装说明 PLASTIC, LCC-32 PLASTIC, LCC-32 PLASTIC, TQFP-32 PLASTIC, TQFP-32 PLASTIC, LCC-32 PLASTIC, TQFP-32 PLASTIC, LCC-32 PLASTIC, LCC-32 PLASTIC, TQFP-32 PLASTIC, LCC-32
针数 32 32 32 32 32 32 32 32 32 32
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 10 ns 12 ns 6.5 ns 6.5 ns 10 ns 12 ns 10 ns 6.5 ns 10 ns 12 ns
最大时钟频率 (fCLK) 66.7 MHz 50 MHz 100 MHz 100 MHz 66.7 MHz 50 MHz 66.7 MHz 100 MHz 66.7 MHz 50 MHz
周期时间 15 ns 20 ns 10 ns 10 ns 15 ns 20 ns 15 ns 10 ns 15 ns 20 ns
JESD-30 代码 R-PQCC-J32 R-PQCC-J32 S-PQFP-G32 S-PQFP-G32 R-PQCC-J32 S-PQFP-G32 R-PQCC-J32 R-PQCC-J32 S-PQFP-G32 R-PQCC-J32
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
长度 13.9954 mm 13.9954 mm 7 mm 7 mm 13.9954 mm 7 mm 13.9954 mm 13.9954 mm 7 mm 13.9954 mm
内存密度 73728 bit 36864 bit 73728 bit 4608 bit 4608 bit 2304 bit 73728 bit 73728 bit 73728 bit 4608 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 9 9 9 9 9 9 9 9 9 9
湿度敏感等级 1 1 3 3 1 3 1 1 3 1
功能数量 1 1 1 1 1 1 1 1 1 1
端子数量 32 32 32 32 32 32 32 32 32 32
字数 8192 words 4096 words 8192 words 512 words 512 words 256 words 8192 words 8192 words 8192 words 512 words
字数代码 8000 4000 8000 512 512 256 8000 8000 8000 512
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C
组织 8KX9 4KX9 8KX9 512X9 512X9 256X9 8KX9 8KX9 8KX9 512X9
可输出 YES YES YES YES YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QCCJ QCCJ LQFP LQFP QCCJ LQFP QCCJ QCCJ LQFP QCCJ
封装等效代码 LDCC32,.5X.6 LDCC32,.5X.6 TQFP32,.35SQ,32 QFP32,.35SQ,32 LDCC32,.5X.6 QFP32,.35SQ,32 LDCC32,.5X.6 LDCC32,.5X.6 TQFP32,.35SQ,32 LDCC32,.5X.6
封装形状 RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
封装形式 CHIP CARRIER CHIP CARRIER FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE CHIP CARRIER FLATPACK, LOW PROFILE CHIP CARRIER CHIP CARRIER FLATPACK, LOW PROFILE CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 225 225 225 225 225 225 225 225
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.55 mm 3.55 mm 1.6 mm 1.6 mm 3.55 mm 1.6 mm 3.55 mm 3.55 mm 1.6 mm 3.55 mm
最大待机电流 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A 0.005 A
最大压摆率 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 J BEND J BEND GULL WING GULL WING J BEND GULL WING J BEND J BEND GULL WING J BEND
端子节距 1.27 mm 1.27 mm 0.8 mm 0.8 mm 1.27 mm 0.8 mm 1.27 mm 1.27 mm 0.8 mm 1.27 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 20 20 20 20 20 20 20 20 20
宽度 11.4554 mm 11.4554 mm 7 mm 7 mm 11.4554 mm 7 mm 11.4554 mm 11.4554 mm 7 mm 11.4554 mm
厂商名称 IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Base Number Matches - 1 1 1 1 1 1 - - -
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