32-BIT, 140MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, |
| 针数 | 429 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.3 |
| SM320C6701GLPS14 | SMJ320C6701GLPS14 | SMJ320C6701GLPS16 | SMJ320C6701GLPW16 | SM320C6701GJC16EP | SM320C6701GJC12EP | SM320C6701GJCA16EP | SM320C6701GLPW16 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 32-BIT, 140MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429 | 32-BIT, 140.84MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429 | 32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429 | 32-BIT, 166.66MHz, OTHER DSP, CBGA429, 27 X 27 MM, CERAMIC, MO-156, BGA-429 | 32-BIT, 166.67MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352 | 32-BIT, 120.48MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352 | 32-BIT, 166.67MHz, OTHER DSP, PBGA352, 35 X 35 MM, PLASTIC, BGA-352 | IC 32-BIT, 167 MHz, OTHER DSP, CBGA429, CERAMIC, BGA-429, Digital Signal Processor |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
| 针数 | 429 | 429 | 429 | 429 | 352 | 352 | 352 | 429 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.3 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 地址总线宽度 | - | 22 | 22 | - | 22 | 22 | 22 | 22 |
| 桶式移位器 | - | NO | NO | - | NO | NO | NO | NO |
| 边界扫描 | - | YES | YES | - | YES | YES | YES | YES |
| 最大时钟频率 | - | 140.84 MHz | 166.66 MHz | - | 166.67 MHz | 120.48 MHz | 166.67 MHz | 167 MHz |
| 外部数据总线宽度 | - | 32 | 32 | - | 32 | 32 | 32 | 32 |
| 格式 | - | FLOATING POINT | FLOATING POINT | - | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
| 内部总线架构 | - | MULTIPLE | MULTIPLE | - | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | - | S-CBGA-B429 | S-CBGA-B429 | - | S-PBGA-B352 | S-PBGA-B352 | S-PBGA-B352 | S-CBGA-B429 |
| 长度 | - | 27 mm | 27 mm | - | 35 mm | 35 mm | 35 mm | 27 mm |
| 低功率模式 | - | YES | YES | - | YES | YES | YES | YES |
| 端子数量 | - | 429 | 429 | - | 352 | 352 | 352 | 429 |
| 封装主体材料 | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | - | BGA | BGA | - | BGA | BGA | BGA | BGA |
| 封装形状 | - | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | GRID ARRAY | GRID ARRAY | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 3.3 mm | 3.3 mm | - | 3.5 mm | 3.5 mm | 3.5 mm | 3.3 mm |
| 最大供电电压 | - | 1.99 V | 1.99 V | - | 1.99 V | 1.89 V | 1.99 V | 1.99 V |
| 最小供电电压 | - | 1.81 V | 1.81 V | - | 1.81 V | 1.71 V | 1.81 V | 1.81 V |
| 标称供电电压 | - | 1.9 V | 1.9 V | - | 1.9 V | 1.8 V | 1.9 V | 1.9 V |
| 表面贴装 | - | YES | YES | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | - | BALL | BALL | - | BALL | BALL | BALL | BALL |
| 端子节距 | - | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | - | 27 mm | 27 mm | - | 35 mm | 35 mm | 35 mm | 27 mm |
| uPs/uCs/外围集成电路类型 | - | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
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