FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, 0.300 INCH, PLASTIC, SOIC-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP24,.4 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 74FCT825ASCX | 74FCT825AFC | 74FCT825ASPC | 74FCT825ASC | 74FCT825APC | |
|---|---|---|---|---|---|
| 描述 | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP24, CERPACK-24 | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 | IC FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO24, 0.300 INCH, PLASTIC, SOIC-24, Bus Driver/Transceiver | FCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | DFP | DIP | SOIC | DIP |
| 包装说明 | SOP, SOP24,.4 | DFP, | DIP, DIP24,.3 | SOP, SOP24,.4 | DIP, |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - |
| 其他特性 | - | WITH TRIPLE OUTPUT ENABLE; WITH CLEAR AND CLOCK ENABLE | WITH TRIPLE OUTPUT ENABLE; WITH CLEAR AND CLOCK ENABLE | WITH TRIPLE OUTPUT ENABLE; WITH CLEAR AND CLOCK ENABLE | WITH TRIPLE OUTPUT ENABLE; WITH CLEAR AND CLOCK ENABLE |
| 系列 | - | FCT | FCT | FCT | FCT |
| JESD-30 代码 | - | R-GDFP-F24 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 |
| 长度 | - | 15.4305 mm | 31.915 mm | 15.4 mm | - |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | - | 8 | 8 | 8 | 8 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端口数量 | - | 2 | 2 | 2 | 2 |
| 端子数量 | - | 24 | 24 | 24 | 24 |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | DFP | DIP | SOP | DIP |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | FLATPACK | IN-LINE | SMALL OUTLINE | IN-LINE |
| 传播延迟（tpd） | - | 10 ns | 10 ns | 10 ns | 10 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 2.286 mm | 5.08 mm | 2.65 mm | - |
| 最大供电电压 (Vsup) | - | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | - | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | NO | YES | NO |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | - | FLAT | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | - | 1.27 mm | 2.54 mm | 1.27 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
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