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IDT74LVC07ADC8

产品描述Buffer, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, SOIC-14
产品类别逻辑    逻辑   
文件大小51KB,共5页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT74LVC07ADC8概述

Buffer, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, SOIC-14

IDT74LVC07ADC8规格参数

参数名称属性值
厂商名称IDT (Integrated Device Technology)
零件包装代码SOIC
包装说明SOIC-14
针数14
Reach Compliance Codeunknown
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G14
JESD-609代码e0
长度8.65 mm
逻辑集成电路类型BUFFER
功能数量6
输入次数1
端子数量14
最高工作温度85 °C
最低工作温度-40 °C
输出特性OPEN-DRAIN
封装主体材料PLASTIC/EPOXY
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
传播延迟(tpd)3.3 ns
认证状态Not Qualified
座面最大高度1.75 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度3.9 mm

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IDT74LVC07A
3.3V CMOS HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
INDUSTRIAL TEMPERATURE RANGE
3.3V CMOS HEX
BUFFER/DRIVER WITH
OPEN-DRAIN OUTPUTS
AND 5 VOLT TOLERANT I/O
• 0.5 MICRON CMOS Technology
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
• V
CC
= 3.3V ± 0.3V, Normal Range
• V
CC
= 2.7V to 3.6V, Extended Range
• CMOS power levels (0.4µ W typ. static)
µ
• Rail-to-Rail output swing for increased noise margin
• All inputs, outputs, and I/Os are 5V tolerant
• Supports hot insertion
• Available in SOIC, SSOP, and TSSOP packages
IDT74LVC07A
FEATURES:
DESCRIPTION:
This hex buffer/driver is built using advanced dual metal CMOS technol-
ogy. The outputs of the LVC07A device are open-drain and can be
connected to other open-drain outputs to implement active-low wired-OR or
active-high wired-AND functions. The maximum sink current is 24mA.
The LVC07A has been designed with a +24mA output driver. This driver
is capable of driving a moderate to heavy load while maintaining speed
performance.
Inputs can be driven from either 2.5V, 3.3V (LVTTL), or 5V (CMOS)
devices. This feature allows the use of this device as a translator in a mixed-
system environment.
DRIVE FEATURES:
• High Output Drivers: ±24mA
• Reduced system switching noise
APPLICATIONS:
• 5V and 3.3V mixed voltage systems
• Data communication and telecommunication systems
FUNCTIONAL BLOCK DIAGRAM
PIN CONFIGURATION
1
A
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
CC
6
A
6
Y
5
A
5
Y
4
A
4
Y
A
Y
1
Y
2
A
2
Y
3
A
3
Y
GND
SOIC/ SSOP/ TSSOP
TOP VIEW
PIN DESCRIPTION
Pin Names
xA
xY
Data Inputs
Data Outputs
Description
FUNCTION TABLE
(EACH BUFFER/DRIVER)
(1)
Inputs
xA
H
L
NOTE:
1. H = HIGH Voltage Level
L = LOW Voltage Level
Outputs (with pull-up)
xY
H
L
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
©2000 Integrated Device Technology, Inc.
JULY 2000
DSC-4723/1

IDT74LVC07ADC8相似产品对比

IDT74LVC07ADC8 IDT74LVC07APG8 IDT74LVC07APY8
描述 Buffer, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, SOIC-14 Buffer, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, TSSOP-14 Buffer, LVC/LCX/Z Series, 6-Func, 1-Input, CMOS, PDSO14, SSOP-14
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 SOIC TSSOP SSOP
包装说明 SOIC-14 TSSOP, SSOP,
针数 14 14 14
Reach Compliance Code unknown unknown unknown
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609代码 e0 e0 e0
长度 8.65 mm 5 mm 6.2 mm
逻辑集成电路类型 BUFFER BUFFER BUFFER
功能数量 6 6 6
输入次数 1 1 1
端子数量 14 14 14
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
输出特性 OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP TSSOP SSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
传播延迟(tpd) 3.3 ns 3.3 ns 3.3 ns
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.75 mm 1.2 mm 2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING GULL WING
端子节距 1.27 mm 0.65 mm 0.65 mm
端子位置 DUAL DUAL DUAL
宽度 3.9 mm 4.4 mm 5.3 mm

 
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