IC,FIFO,512X9,ASYNCHRONOUS,ACT-CMOS,LDCC,32PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | QCCJ, LDCC32,.5X.6 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PQCC-J32 |
| JESD-609代码 | e0 |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 9 |
| 端子数量 | 32 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 512X9 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC32,.5X.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.01 A |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 74ACT725QC | 54ACT725LM | 74ACT725SC | 54ACT725DM | 54ACT725FM | 74ACT725PC | |
|---|---|---|---|---|---|---|
| 描述 | IC,FIFO,512X9,ASYNCHRONOUS,ACT-CMOS,LDCC,32PIN,PLASTIC | 54ACT725LM | IC,FIFO,512X9,ASYNCHRONOUS,ACT-CMOS,SOP,28PIN,PLASTIC | IC,FIFO,512X9,ASYNCHRONOUS,ACT-CMOS,DIP,28PIN,CERAMIC | IC,FIFO,512X9,ASYNCHRONOUS,ACT-CMOS,FP,28PIN,CERAMIC | IC,FIFO,512X9,ASYNCHRONOUS,ACT-CMOS,DIP,28PIN,PLASTIC |
| 包装说明 | QCCJ, LDCC32,.5X.6 | QCCN, LCC32(UNSPEC) | SOP, SOP28,.4 | DIP, DIP28,.6 | DFP, FL28(UNSPEC) | DIP, DIP28,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
| 端子数量 | 32 | 32 | 28 | 28 | 28 | 28 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| 组织 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 | 512X9 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCN | SOP | DIP | DFP | DIP |
| 封装等效代码 | LDCC32,.5X.6 | LCC32(UNSPEC) | SOP28,.4 | DIP28,.6 | FL28(UNSPEC) | DIP28,.6 |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | J BEND | NO LEAD | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| JESD-30 代码 | R-PQCC-J32 | - | R-PDSO-G28 | R-XDIP-T28 | R-XDFP-F28 | R-PDIP-T28 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm | - | 2.54 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 |
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