Part of the GreenLine™ Portfolio of devices with energy–conserving traits.
This switching diode has the following features:
•
Very Low Leakage (≤ 500 pA) promotes extended battery life by decreas-
ing energy waste
•
Offered in four Surface Mount package types
•
Available in 8 mm Tape and Reel in quantities of 3,000
Applications
•
ESD Protection
•
Reverse Polarity Protection
•
Steering Logic
•
Medium–Speed Switching
MMBD1000LT1
MMBD2000T1
MMBD3000T1
MMSD1000T1
Motorola Preferred Devices
MMBD1000LT1
3
1
2
CASE 318-08, STYLE 8
SOT-23 (TO-236AB)
3
CATHODE
1
ANODE
MAXIMUM RATINGS
Rating
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
Symbol
VR
IF
IFM
(surge)
Value
30
200
500
Unit
Vdc
mAdc
1
MMBD2000T1
3
mA
2
DEVICE MARKING
MMBD1000LT1 = AY
MMBD2000T1 = DH
MMBD3000T1 = XP
MMSD1000T1 = 4K
CASE 419-02, STYLE 2
SC–70/SOT–323
3
CATHODE
1
ANODE
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR-4 Board (1)
TA = 25°C
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
Derate above 25°C MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
Thermal Resistance Junction to Ambient
MMBD1000LT1, MMBD3000T1,
MMSD1000T1
MMBD2000T1
Junction and Storage Temperature
Symbol
PD
225
150
1.8
1.2
R
θJA
°C/W
556
833
TJ, Tstg
– 55 to +150
°C
1
MMBD3000T1
Max
Unit
mW
2
1
3
CASE 318D-04, STYLE 2
SC–59
mW/°C
3
CATHODE
2
ANODE
MMSD1000T1
2
(1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum
recommended footprint.
CASE 425-04, STYLE 1
SOD–123
1
CATHODE
2
ANODE
Preferred
devices are Motorola recommended choices for future use and best overall value.
REV 1
3–46
Motorola Small–Signal Transistors, FETs and Diodes Device Data
MMBD1000LT1 MMBD2000T1 MMBD3000T1 MMSD1000T1
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100
µA)
Reverse Voltage Leakage Current (VR = 75 V)
Forward Voltage (IF = 1.0 mA)
Forward Voltage
(IF = 10 mA)
Diode Capacitance (VR = 0 V, f = 1.0 MHz)
Reverse Recovery Time (IF = IR = 10 mA) (Figure 1)
V(BR)
IR
VF
CD
trr
30
—
—
—
—
—
—
500
850
950
2.0
3.0
V
pA
mV
pF
µs
Symbol
Min
Max
Unit
820
Ω
+10 V
2k
100
µH
0.1
µF
DUT
50
Ω
OUTPUT
PULSE
GENERATOR
50
Ω
INPUT
SAMPLING
OSCILLOSCOPE
90%
VR
INPUT SIGNAL
IR
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
IF
0.1
µF
tr
10%
tp
t
IF
trr
t
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes:
2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes:
3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3–47
Tape and Reel Specifications
and Packaging Specifications
Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the
shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure
cavity for the product when sealed with the “peel–back” cover tape.
•
•
•
•
Two Reel Sizes Available (7″ and 13″)
Used for Automatic Pick and Place Feed Systems
Minimizes Product Handling
EIA 481, –1, –2
•
SOD–123, SC–59, SC–70/SOT–323, SC–70ML/SOT–363,
SOT–23, TSOP–6, in 8 mm Tape
•
SOT–223 in 12 mm Tape
•
SO–14, SO–16 in 16 mm Tape
Use the standard device title and add the required suffix as listed in the option table on the following page. Note that the individual
reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is
one full reel for each line item, and orders are required to be in increments of the single reel quantity.
SOD–123
8 mm
SC–59, SC–70/SOT–323, SOT–23
8 mm
SC–70ML/SOT–363, TSOP–6
T1 ORIENTATION
8 mm
SOT–223
12 mm
SO–14, 16
16 mm
SC–70ML/SOT–363
T2 ORIENTATION
8 mm
DIRECTION
OF FEED
EMBOSSED TAPE AND REEL ORDERING INFORMATION
Tape Width
(mm)
8
8
8
16
16
16
16
8
8
8
8
12
12
8
8
8
Pitch
(inch)
Reel Size
mm
(inch)
178
178
330
178
330
178
330
178
330
178
330
178
330
178
178
178
(7)
(7)
(13)
(7)
(13)
(7)
(13)
(7)
(13)
(7)
(13)
(7)
(13)
(7)
(7)
(7)
Devices Per Reel
and Minimum
Order Quantity
3,000
3,000
10,000
500
2,500
500
2,500
3,000
10,000
3,000
10,000
1,000
4,000
3,000
3,000
3,000
Device
Suffix
T1
T1
T3
R1
R2
R1
R2
T1
T3
T1
T3
T1
T3
T1
T2
T1
Package
SC–59
SC–70/SOT–323
SO–14
SO–16
SOD–123
SOT–23
SOT–223
SC–70ML/SOT–363
TSOP–6
mm
4.0
±
0.1 (.157
±
.004)
4.0
±
0.1 (.157
±
.004)
8.0
±
0.1 (.315
±
.004)
8.0
±
0.1 (.315
±
.004)
4.0
±
0.1 (.157
±
.004)
4.0
±
0.1 (.157
±
.004)
8.0
±
0.1 (.315
±
.004)
4.0
±
0.1 (.157
±
.004)
4.0
±
0.1 (.157
±
.004)
Tape and Reel Specifications
6–2
Motorola Small–Signal Transistors, FETs and Diodes Device Data
EMBOSSED TAPE AND REEL DATA FOR DISCRETES
CARRIER TAPE SPECIFICATIONS
10 Pitches Cumulative Tolerance on Tape
±
0.2 mm
(± 0.008″)
E
Top Cover
Tape
A0
B0
P
Embossment
Center Lines
of Cavity
D1
For Components
2.0 mm x 1.2 mm and Larger
K
t
D
P0
P2
F
W
B1
K0
See
Note 1
For Machine Reference Only
Including Draft and RADII
Concentric Around B0
User Direction of Feed
* Top Cover Tape
Thickness (t1)
0.10 mm
(.004″) Max.
Bar Code Label
R Min
Tape and Components
Shall Pass Around Radius “R”
Without Damage
Bending Radius
10°
Maximum Component Rotation
100 mm
(3.937″)
Embossed Carrier
Embossment
1 mm Max
Typical Component
Cavity Center Line
Tape
1 mm
(.039″) Max
Typical Component
Center Line
Camber (Top View)
Allowable Camber To Be 1 mm/100 mm Nonaccumulative Over 250 mm
250 mm
(9.843″)
DIMENSIONS
Tape
Size
8 mm
12 mm
16 mm
24 mm
B1 Max
4.55 mm
(.179″)
8.2 mm
(.323″)
12.1 mm
(.476″)
20.1 mm
(.791″)
D
1.5 + 0.1 mm
– 0.0
( 0 9 + .004″
(.059 004
– 0.0)
D1
1.0 Min
(.039″)
1.5 mm Min
(.060″)
E
1.75
±
0.1 mm
(.069
±
.004″)
F
3.5
±
0.05 mm
(.138
±
.002″)
5.5
±
0.05 mm
(.217
±
.002″)
7.5
±
0.10 mm
(.295
±
.004″)
11.5
±
0.1 mm
(.453
±
.004″)
K
2.4 mm Max
(.094″)
6.4 mm Max
(.252″)
7.9 mm Max
(.311″)
11.9 mm Max
(.468″)
P0
4.0
±
0.1 mm
(.157
±
.004″)
P2
2.0
±
0.1 mm
(.079
±
.002″)
R Min
25 mm
(.98″)
30 mm
(1.18″)
T Max
0.6 mm
(.024″)
W Max
8.3 mm
(.327″)
12
±
.30 mm
(.470
±
.012″)
16.3 mm
(.642″)
24.3 mm
(.957″)
Metric dimensions govern — English are in parentheses for reference only.
NOTE 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be within .05 mm min. to .50 mm max.,
NOTE 1:
the component cannot rotate more than 10° within the determined cavity.
NOTE 2: If B1 exceeds 4.2 mm (.165) for 8 mm embossed tape, the tape may not feed through all tape feeders.
NOTE 3: Pitch information is contained in the Embossed Tape and Reel Ordering Information on pg. 5.12–3.
Motorola Small–Signal Transistors, FETs and Diodes Device Data
Tape and Reel Specifications
6–3
EMBOSSED TAPE AND REEL DATA FOR DISCRETES
T Max
Outside Dimension
Measured at Edge
1.5 mm Min
(.06″)
A
20.2 mm Min
(.795″)
13.0 mm
±
0.5 mm
(.512″
±
.002″)
50 mm Min
(1.969″)
Full Radius
G
Inside Dimension
Measured Near Hub
Size
8 mm
12 mm
16 mm
24 mm
A Max
330 mm
(12.992″)
330 mm
(12.992″)
360 mm
(14.173″)
360 mm
(14.173″)
G
8.4 mm + 1.5 mm, – 0.0
(.33″ + .059″, – 0.00)
12.4 mm + 2.0 mm, – 0.0
(.49″ + .079″, – 0.00)
16.4 mm + 2.0 mm, – 0.0
(.646″ + .078″, – 0.00)
24.4 mm + 2.0 mm, – 0.0
(.961″ + .070″, – 0.00)
T Max
14.4 mm
(.56″)
18.4 mm
(.72″)
22.4 mm
(.882″)
30.4 mm
(1.197″)
Reel Dimensions
Metric Dimensions Govern — English are in parentheses for reference only
Tape and Reel Specifications
6–4
Motorola Small–Signal Transistors, FETs and Diodes Device Data
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