Microprogram Sequencer, 6-Bit, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | AMD(超微) |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 28 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.A.2 |
最大时钟频率 | 33 MHz |
外部数据总线宽度 | 6 |
JESD-30 代码 | R-PDIP-T28 |
JESD-609代码 | e0 |
长度 | 35.306 mm |
端子数量 | 28 |
最高工作温度 | 75 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
AM29CPL151H-33PC | AM29CPL151H-25JC | AM29CPL151H-33DC | AM29CPL151H-25DC | AM29CPL151H-25PC | AM29CPL151H-33JC | |
---|---|---|---|---|---|---|
描述 | Microprogram Sequencer, 6-Bit, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | Microprogram Sequencer, 6-Bit, CMOS, PQCC28, PLASTIC, LCC-28 | Microprogram Sequencer, 6-Bit, CMOS, CDIP28, 0.300 INCH, WINDOWED, SKINNY, CERAMIC, DIP-28 | Microprogram Sequencer, 6-Bit, CMOS, CDIP28, 0.300 INCH, WINDOWED, SKINNY, CERAMIC, DIP-28 | Microprogram Sequencer, 6-Bit, CMOS, PDIP28, 0.300 INCH, SKINNY, PLASTIC, DIP-28 | Microprogram Sequencer, 6-Bit, CMOS, PQCC28, PLASTIC, LCC-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | QLCC | DIP | DIP | DIP | QLCC |
包装说明 | DIP, | PLASTIC, LCC-28 | WDIP, | WDIP, | DIP, | QCCJ, |
针数 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
最大时钟频率 | 33 MHz | 25 MHz | 33 MHz | 25 MHz | 25 MHz | 33 MHz |
外部数据总线宽度 | 6 | 6 | 6 | 6 | 6 | 6 |
JESD-30 代码 | R-PDIP-T28 | S-PQCC-J28 | R-CDIP-T28 | R-CDIP-T28 | R-PDIP-T28 | S-PQCC-J28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 35.306 mm | 11.5062 mm | 37.1475 mm | 37.1475 mm | 35.306 mm | 11.5062 mm |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | QCCJ | WDIP | WDIP | DIP | QCCJ |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | CHIP CARRIER | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 4.57 mm | 5.588 mm | 5.588 mm | 5.08 mm | 4.57 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | NO | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 11.5062 mm | 7.62 mm | 7.62 mm | 7.62 mm | 11.5062 mm |
uPs/uCs/外围集成电路类型 | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER | BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER |
厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
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