Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, 0.150 INCH, SOIC-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| 系列 | FCT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 9.9 mm |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 225 |
| 传播延迟(tpd) | 4.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9 mm |

| IDT74FCT251CTDC | IDT74FCT251ATDC | IDT74FCT251ATSO | IDT74FCT251CTSO | IDT74FCT251ATQ | IDT74FCT251CTQ | |
|---|---|---|---|---|---|---|
| 描述 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, 0.150 INCH, SOIC-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, 0.150 INCH, SOIC-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, SOIC-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, SOIC-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16 | Multiplexer, FCT Series, 1-Func, 8 Line Input, 1 Line Output, Complementary Output, CMOS, PDSO16, QSOP-16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, | SOP, | SOP, SOP16,.4 | SOP, SOP16,.4 | SSOP, | SSOP, |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | not_compliant | not_compliant | compliant | compliant |
| 是否无铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 |
| 系列 | FCT | FCT | - | FCT | FCT | FCT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 |
| 长度 | 9.9 mm | 9.9 mm | - | 10.3 mm | 4.9 mm | 4.9 mm |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | - | 8 | 8 | 8 |
| 输出次数 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | - | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | - | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | - | SOP | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 225 | 225 | - | - | 225 | 225 |
| 传播延迟(tpd) | 4.5 ns | 5.2 ns | - | 4.5 ns | 5.2 ns | 4.5 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | - | 2.65 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | - | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | - | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | - | 30 | 30 |
| 宽度 | 3.9 mm | 3.9 mm | - | 7.5 mm | 3.9116 mm | 3.9116 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved