Line Driver/Receiver, 1 Driver, Hybrid, MDIP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Dynex |
| 包装说明 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| 差分输出 | YES |
| 驱动器位数 | 1 |
| 高电平输入电流最大值 | 0.00008 A |
| JESD-30 代码 | R-MDIP-T24 |
| JESD-609代码 | e0 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最小输出摆幅 | 26 V |
| 最大输出低电流 | 0.004 A |
| 封装主体材料 | METAL |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,+-15 V |
| 认证状态 | Not Qualified |
| 最大接收延迟 | 450 ns |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| CT1487MI | CT1487MIFP | CT1487MFP | CT1487DIFP | CT1487DI | CT1487D | CT1589MIFP | CT1589MFP | CT1589DI | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Line Driver/Receiver, 1 Driver, Hybrid, MDIP24, | Line Driver/Receiver, 1 Driver, Hybrid, CDFP24, | Line Driver/Receiver, 1 Driver, Hybrid, CDFP24, | Line Driver/Receiver, 2 Driver, Hybrid, MDFP36, | Line Driver/Receiver, 2 Driver, Hybrid, MDIP36, | Line Driver/Receiver, 2 Driver, Hybrid, MDIP36, | Line Driver/Receiver, 1 Driver, Hybrid, CDFP24, | Line Driver/Receiver, 1 Driver, Hybrid, CDFP24, | Line Driver/Receiver, 2 Driver, Hybrid, MDIP36, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Dynex | Dynex | Dynex | Dynex | Dynex | Dynex | Dynex | Dynex | Dynex |
| 包装说明 | DIP, DIP24,.6 | DFP, FL24,.74,100 | DFP, FL24,.74,100 | DFP, FL36,.8,100 | DIP, DIP36,.6 | DIP, DIP36,.6 | DFP, FL24,.74,100 | DFP, FL24,.74,100 | DIP, DIP36,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 差分输出 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 驱动器位数 | 1 | 1 | 1 | 2 | 2 | 2 | 1 | 1 | 2 |
| 高电平输入电流最大值 | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A | 0.0001 A | 0.00008 A | 0.00008 A | 0.00008 A | 0.00008 A |
| JESD-30 代码 | R-MDIP-T24 | R-XDFP-F24 | R-XDFP-F24 | R-MDFP-F36 | R-MDIP-T36 | R-MDIP-T36 | R-XDFP-F24 | R-XDFP-F24 | R-MDIP-T36 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 24 | 24 | 24 | 36 | 36 | 36 | 24 | 24 | 36 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 最小输出摆幅 | 26 V | 26 V | 26 V | 26 V | 26 V | 26 V | 26 V | 26 V | 26 V |
| 最大输出低电流 | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.008 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 封装主体材料 | METAL | CERAMIC | CERAMIC | METAL | METAL | METAL | CERAMIC | CERAMIC | METAL |
| 封装代码 | DIP | DFP | DFP | DFP | DIP | DIP | DFP | DFP | DIP |
| 封装等效代码 | DIP24,.6 | FL24,.74,100 | FL24,.74,100 | FL36,.8,100 | DIP36,.6 | DIP36,.6 | FL24,.74,100 | FL24,.74,100 | DIP36,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| 电源 | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-12 V | 5,+-12 V | 5,+-12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大接收延迟 | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns |
| 表面贴装 | NO | YES | YES | YES | NO | NO | YES | YES | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved