Standard SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | TQFP-80 |
| 针数 | 80 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 45 ns |
| 其他特性 | AUTOMATIC POWER-DOWN |
| JESD-30 代码 | S-PQFP-G80 |
| JESD-609代码 | e0 |
| 长度 | 14 mm |
| 内存密度 | 131072 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 80 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP80,.64SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.015 A |
| 最大压摆率 | 0.34 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 14 mm |
| IDT70825S45PF | IDT70825S45G | IDT70825L25GB | IDT70825S25GB | IDT70825S35GB | IDT70825S35PFB | IDT70825L45G | |
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 8KX16, 45ns, CMOS, PQFP80, TQFP-80 | Standard SRAM, 8KX16, 45ns, CMOS, CPGA84, PGA-84 | Multi-Port SRAM, 8KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84 | Multi-Port SRAM, 8KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84 | Standard SRAM, 8KX16, 35ns, CMOS, CPGA84, PGA-84 | Standard SRAM, 8KX16, 35ns, CMOS, PQFP80, TQFP-80 | Standard SRAM, 8KX16, 45ns, CMOS, CPGA84, PGA-84 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | PGA | PGA | PGA | PGA | QFP | PGA |
| 包装说明 | TQFP-80 | PGA-84 | PGA, | PGA, | PGA-84 | TQFP-80 | PGA-84 |
| 针数 | 80 | 84 | 84 | 84 | 84 | 80 | 84 |
| Reach Compliance Code | not_compliant | not_compliant | compliant | compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 |
| 最长访问时间 | 45 ns | 45 ns | 25 ns | 25 ns | 35 ns | 35 ns | 45 ns |
| JESD-30 代码 | S-PQFP-G80 | S-CPGA-P84 | S-CPGA-P84 | S-CPGA-P84 | S-CPGA-P84 | S-PQFP-G80 | S-CPGA-P84 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 14 mm | 27.94 mm | 27.94 mm | 27.94 mm | 27.94 mm | 14 mm | 27.94 mm |
| 内存密度 | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 80 | 84 | 84 | 84 | 84 | 80 | 84 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| 最低工作温度 | - | - | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 组织 | 8KX16 | 8KX16 | 8KX16 | 8KX16 | 8KX16 | 8KX16 | 8KX16 |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | LQFP | PGA | PGA | PGA | PGA | LQFP | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | FLATPACK, LOW PROFILE | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 240 | 225 | 225 | 225 | 225 | 240 | 225 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 5.207 mm | 5.207 mm | 5.207 mm | 5.207 mm | 1.6 mm | 5.207 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | GULL WING | PIN/PEG |
| 端子节距 | 0.65 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 0.65 mm | 2.54 mm |
| 端子位置 | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | 20 | 30 | 30 | 30 | 30 | 20 | 30 |
| 宽度 | 14 mm | 27.94 mm | 27.94 mm | 27.94 mm | 27.94 mm | 14 mm | 27.94 mm |
| 其他特性 | AUTOMATIC POWER-DOWN | AUTOMATIC POWER-DOWN | ALSO REGISTERED SEQUENTIAL ACCESS PORT; TSU=5NS; TCO=25NS | ALSO REGISTERED SEQUENTIAL ACCESS PORT; TSU=5NS; TCO=25NS | AUTOMATIC POWER-DOWN | - | AUTOMATIC POWER-DOWN |
| 封装等效代码 | QFP80,.64SQ | PGA84M,11X11 | - | - | PGA84M,11X11 | QFP80,.64SQ | PGA84M,11X11 |
| 电源 | 5 V | 5 V | - | - | 5 V | 5 V | 5 V |
| 最大待机电流 | 0.015 A | 0.015 A | - | - | 0.03 A | 0.03 A | 0.0015 A |
| 最大压摆率 | 0.34 mA | 0.34 mA | - | - | 0.4 mA | 0.4 mA | 0.29 mA |
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