0.1A 4 CHANNEL, BUF OR INV BASED PRPHL DRVR, UUC, WAFER
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | WAFER |
包装说明 | DIE, |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
内置保护 | TRANSIENT |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | X-XUUC-N |
标称负供电电压 | -52 V |
功能数量 | 4 |
最高工作温度 | 85 °C |
输出电流流向 | SINK |
标称输出峰值电流 | 0.1 A |
封装主体材料 | UNSPECIFIED |
封装代码 | DIE |
封装形状 | UNSPECIFIED |
封装形式 | UNCASED CHIP |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | BIPOLAR |
端子形式 | NO LEAD |
端子位置 | UPPER |
断开时间 | 10 µs |
接通时间 | 10 µs |
DS3680MWC | DS3680DG4 | DS3680DRG4 | DS3680NE4 | DS3680 | DS3680MDC | DS3680N/NOPB | |
---|---|---|---|---|---|---|---|
描述 | 0.1A 4 CHANNEL, BUF OR INV BASED PRPHL DRVR, UUC, WAFER | Gate Drivers Quad Telephone Relay | Gate Drivers Quad Tele Relay Drivers | Gate Drivers Quad Telephone Relay | DS3680 Quad Telephone Relay Drivers | 0.1A 4 CHANNEL, BUF OR INV BASED PRPHL DRVR, UUC, DIE | 0.1A 4 CHANNEL, BUF OR INV BASED PRPHL DRVR, PDIP14, PLASTIC, DIP-14 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | WAFER | SOIC | SOIC | DIP | - | DIE | DIP |
包装说明 | DIE, | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | - | DIE, | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | - | unknown | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
内置保护 | TRANSIENT | TRANSIENT | TRANSIENT | - | - | TRANSIENT | TRANSIENT |
接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | - | - | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码 | X-XUUC-N | R-PDSO-G14 | R-PDSO-G14 | - | - | X-XUUC-N | R-PDIP-T14 |
标称负供电电压 | -52 V | -52 V | -52 V | - | - | -52 V | -52 V |
功能数量 | 4 | 4 | 4 | - | - | 4 | 4 |
最高工作温度 | 85 °C | 70 °C | 70 °C | - | - | 85 °C | 85 °C |
输出电流流向 | SINK | SOURCE | SOURCE | - | - | SINK | SOURCE |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | UNSPECIFIED | PLASTIC/EPOXY |
封装代码 | DIE | SOP | SOP | - | - | DIE | DIP |
封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | - | - | UNSPECIFIED | RECTANGULAR |
封装形式 | UNCASED CHIP | SMALL OUTLINE | SMALL OUTLINE | - | - | UNCASED CHIP | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | - | - | YES | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | - | - | BIPOLAR | BIPOLAR |
端子形式 | NO LEAD | GULL WING | GULL WING | - | - | NO LEAD | THROUGH-HOLE |
端子位置 | UPPER | DUAL | DUAL | - | - | UPPER | DUAL |
断开时间 | 10 µs | 10 µs | 10 µs | - | - | 10 µs | 10 µs |
接通时间 | 10 µs | 10 µs | 10 µs | - | - | 10 µs | 10 µs |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - | - | 不含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 | - | - | 符合 |
针数 | - | 14 | 14 | 14 | - | - | 14 |
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