F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | F/FAST |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 输出次数 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 最大电源电流(ICC) | 15 mA |
| 传播延迟(tpd) | 8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| SN54F158AFKR | SNJ54F158AJ | SNJ54F158AFKR | SNJ54F158AFK | |
|---|---|---|---|---|
| 描述 | F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CDIP16, 0.300 INCH, CERAMIC, DIP-16 | F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | F/FAST SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC | DIP | QLCC | QLCC |
| 包装说明 | QCCN, | 0.300 INCH, CERAMIC, DIP-16 | QCCN, | QCCN, LCC20,.35SQ |
| 针数 | 20 | 16 | 20 | 20 |
| Reach Compliance Code | unknown | not_compliant | unknown | _compli |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 |
| 长度 | 8.89 mm | 19.56 mm | 8.89 mm | 8.89 mm |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 |
| 输出次数 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 16 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | QCCN | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 最大电源电流(ICC) | 15 mA | 15 mA | 15 mA | 15 mA |
| 传播延迟(tpd) | 8 ns | 8 ns | 8 ns | 8 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | QUAD |
| 宽度 | 8.89 mm | 7.62 mm | 8.89 mm | 8.89 mm |
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