0.7 - 4.0 GHz Wide Bandwidth Integrated Direct Down Conversion Receiver 48-VQFN -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC48,.27SQ,20 |
| 针数 | 48 |
| Reach Compliance Code | compli |
| Factory Lead Time | 1 week |
| Samacsys Confidence | |
| Samacsys Status | Released |
| Samacsys PartID | 608144 |
| Samacsys Pin Cou | 49 |
| Samacsys Part Category | Integrated Circui |
| Samacsys Package Category | Othe |
| Samacsys Footprint Name | QFN50P700X700X100-49N |
| Samacsys Released Date | 2017-01-12 12:59:53 |
| Is Samacsys | N |
| JESD-30 代码 | S-PQCC-N48 |
| JESD-609代码 | e4 |
| 长度 | 7 mm |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC48,.27SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7 mm |
| Base Number Matches | 1 |
| TRF371125IRGZR | TRF371125IRGZT | |
|---|---|---|
| 描述 | 0.7 - 4.0 GHz Wide Bandwidth Integrated Direct Down Conversion Receiver 48-VQFN -40 to 85 | 0.7 - 4.0 GHz Wide Bandwidth Integrated Direct Down Conversion Receiver 48-VQFN -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 |
| 零件包装代码 | QFN | QFN |
| 包装说明 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 |
| 针数 | 48 | 48 |
| Reach Compliance Code | compli | compli |
| Samacsys Status | Released | Released |
| Samacsys PartID | 608144 | 608145 |
| Samacsys Pin Cou | 49 | 49 |
| Samacsys Part Category | Integrated Circui | Integrated Circui |
| Samacsys Package Category | Othe | Othe |
| Samacsys Footprint Name | QFN50P700X700X100-49N | QFN50P700X700X100-49N |
| Samacsys Released Date | 2017-01-12 12:59:53 | 2017-01-12 12:59:53 |
| Is Samacsys | N | N |
| JESD-30 代码 | S-PQCC-N48 | S-PQCC-N48 |
| JESD-609代码 | e4 | e4 |
| 长度 | 7 mm | 7 mm |
| 湿度敏感等级 | 2 | 2 |
| 功能数量 | 1 | 1 |
| 端子数量 | 48 | 48 |
| 最高工作温度 | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | HVQCCN |
| 封装等效代码 | LCC48,.27SQ,20 | LCC48,.27SQ,20 |
| 封装形状 | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 |
| 电源 | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified |
| 座面最大高度 | 1 mm | 1 mm |
| 标称供电电压 | 5 V | 5 V |
| 表面贴装 | YES | YES |
| 电信集成电路类型 | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 7 mm |
| Base Number Matches | 1 | 1 |
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