NOR Gate, TTL, CDFP14,
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 包装说明 | DFP, FL14,.3 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-XDFP-F14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | NOR GATE |
| 湿度敏感等级 | 2A |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 250 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 74S260FC | 54S260DMQB | 54LS260FM | 54LS260DM | 74S260DC | 74S260PC | 74LS260DC | 74LS260FC | 74LS260PC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | NOR Gate, TTL, CDFP14, | NOR Gate, S Series, 2-Func, 5-Input, TTL, CDIP14, CERAMIC, DIP-14 | NOR Gate, TTL, CDFP14, | NOR Gate, TTL, CDIP14 | NOR Gate, TTL, CDIP14, | NOR Gate, TTL, PDIP14, | NOR Gate, TTL, CDIP14, | NOR Gate, TTL, CDFP14, | NOR Gate, TTL, PDIP14 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compliant | unknown | compliant | unknown | compliant | compliant | compliant | compliant | unknow |
| 是否无铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 厂商名称 | Fairchild | - | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| 包装说明 | DFP, FL14,.3 | DIP, DIP14,.3 | - | - | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 |
| JESD-30 代码 | R-XDFP-F14 | R-CDIP-T14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 | - | R-XDIP-T14 | R-XDFP-F14 | R-PDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 逻辑集成电路类型 | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE | - | NOR GATE | NOR GATE | NOR GATE |
| 湿度敏感等级 | 2A | - | 2A | - | 2A | - | 2A | 2A | - |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | - | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC | - | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DFP | DIP | DFP | DIP | DIP | - | DIP | DFP | DIP |
| 封装等效代码 | FL14,.3 | DIP14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 | - | DIP14,.3 | FL14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | IN-LINE | - | IN-LINE | FLATPACK | IN-LINE |
| 峰值回流温度（摄氏度） | 250 | NOT SPECIFIED | 250 | NOT SPECIFIED | 250 | - | 250 | 250 | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | - | NO | NO | NO |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | NO | - | NO | YES | NO |
| 技术 | TTL | TTL | TTL | TTL | TTL | - | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | - | 30 | 30 | NOT SPECIFIED |
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