HMC-XTB106
v01.1207
GaAs MMIC PASSIVE x3 FREQUENCY
MULTIPLIER, 24 - 30 GHz INPUT
Features
Conversion Loss: 19 dB
Input Drive: +13 dBm
Passive: No DC Bias Required
Die Size: 1.1 x 1.45 x 0.1 mm
Typical Applications
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
This HMC-XTB106 is ideal for:
• FCC E-Band Communication Systems
• Short-Haul / High Capacity Radios
• Automotive Radar
• Test & Measurement Equipment
Functional Diagram
General Description
The HMC-XTB106 is a monolithic X3 Passive Fre-
quency Multiplier which utilizes GaAs Shottky Diode
technology, and exhibits low conversion loss and high
Fo isolation. This wideband X3 multiplier requires
no DC power, and is targeted to high volume appli-
cations where frequency X3 of a lower frequency is
more economical than directly generating a higher
frequency. All bond pads and the die backside are
Ti/Au metallized and the Shottky diode devices are
fully passivated for reliable operation. The HMC-
XTB106 Passive X3 MMIC is compatible with
conventional die attach methods, as well as thermo-
compression and thermosonic wire bonding, making
it ideal for MCM and hybrid microcircuit applications.
All data shown herein is measured with the chip in a
50 Ohm environment and contacted with RF probes.
Electrical Specifi cations*, T
A
= 25 °C, Pin = +13 dBm
Parameter
Frequency Range Input
Frequency Range Output
Conversion Loss
*Unless otherwise indicated, all measurements are from probed die
Min.
Typ.
24 - 30
72 - 90
19
Max.
Units
GHz
GHz
dB
2 - 80
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC-XTB106
v01.1207
GaAs MMIC PASSIVE x3 FREQUENCY
MULTIPLIER, 24 - 30 GHz INPUT
x3 Conversion Loss
-17
X3 CONVERSION LOSS (dB)
-18
-19
-20
-21
-22
-23
-24
24
25
26
27
28
29
30
31
INPUT FREQUENCY (GHz)
Output Power
0
-1
X3 OUPUT POWER (dBm)
-2
-3
-4
-5
-6
-7
-8
24
25
26
27
28
29
30
31
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2
HMC-XTB106
v01.1207
GaAs MMIC PASSIVE x3 FREQUENCY
MULTIPLIER, 24 - 30 GHz INPUT
Absolute Maximum Ratings
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
RF Input Level
Storage Temperature
Operating Temperature
+18 dBm
-65 to +150 °C
-55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information
[1]
Standard
WP - 3
Alternate
[2]
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
2 - 82
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC-XTB106
v01.1207
GaAs MMIC PASSIVE x3 FREQUENCY
MULTIPLIER, 24 - 30 GHz INPUT
Pad Descriptions
Pad Number
1
Function
RFIN
Description
This pad is DC coupled and matched to 50 Ohms.
Interface Schematic
2
RFOUT
This pad is DC coupled and matched to 50 Ohms.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2
HMC-XTB106
v01.1207
GaAs MMIC PASSIVE x3 FREQUENCY
MULTIPLIER, 24 - 30 GHz INPUT
Assembly Diagram
2
FREQUENCY MULTIPLIERS - PASSIVE - CHIP
2 - 84
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com