2MX8 MASK PROM, 250ns, PDSO48, PLASTIC, SOP-48
| 参数名称 | 属性值 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC |
| 包装说明 | SSOP, |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 250 ns |
| 备用内存宽度 | 16 |
| JESD-30 代码 | R-PDSO-G48 |
| 长度 | 20 mm |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 宽度 | 14 mm |
| HN624116F-25L | HN624116P-25L | HN624116FB-25L | HN624116F-30L | HN624116FB-30L | HN624116P-30L | |
|---|---|---|---|---|---|---|
| 描述 | 2MX8 MASK PROM, 250ns, PDSO48, PLASTIC, SOP-48 | 2MX8 MASK PROM, 250ns, PDIP42, PLASTIC, DIP-42 | 2MX8 MASK PROM, 250ns, PDSO44, PLASTIC, SOP-44 | 2MX8 MASK PROM, 300ns, PDSO48, PLASTIC, SOP-48 | 2MX8 MASK PROM, 300ns, PDSO44, PLASTIC, SOP-44 | 2MX8 MASK PROM, 300ns, PDIP42, PLASTIC, DIP-42 |
| 零件包装代码 | SOIC | DIP | SOIC | SOIC | SOIC | DIP |
| 包装说明 | SSOP, | DIP, | SOP, | SSOP, | SOP, | DIP, |
| 针数 | 48 | 42 | 44 | 48 | 44 | 42 |
| Reach Compliance Code | compliant | compli | compliant | unknown | unknown | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 250 ns | 250 ns | 250 ns | 300 ns | 300 ns | 300 ns |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | R-PDSO-G48 | R-PDIP-T42 | R-PDSO-G44 | R-PDSO-G48 | R-PDSO-G44 | R-PDIP-T42 |
| 长度 | 20 mm | 52.8 mm | 28.5 mm | 20 mm | 28.5 mm | 52.8 mm |
| 内存密度 | 16777216 bit | 16777216 bi | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 42 | 44 | 48 | 44 | 42 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | DIP | SOP | SSOP | SOP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3 mm | 5.08 mm | 3.22 mm | 3 mm | 3.22 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3.5 V | 3.5 V | 3.5 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.8 mm | 2.54 mm | 1.27 mm | 0.8 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 14 mm | 15.24 mm | 12.6 mm | 14 mm | 12.6 mm | 15.24 mm |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
