74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state TSSOP2 20-Pin
| 参数名称 | 属性值 |
| Brand Name | Nexperia |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 零件包装代码 | TSSOP2 |
| 包装说明 | TSSOP, |
| 针数 | 20 |
| 制造商包装代码 | SOT360-1 |
| Reach Compliance Code | compliant |
| Samacsys Description | 74AHC(T)541 - Octal buffer/line driver; 3-state@en-us |
| 其他特性 | WITH DUAL OUTPUT ENABLE |
| 系列 | AHC/VHC/H/U/V |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 6.5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 13.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| 74AHC541PW,112 | 74AHC541BQ,115 | 74AHC541D,112 | 74AHC541D,118 | 74AHC541PW,118 | 74AHCT541BQ,115 | 74AHCT541D,112 | 74AHCT541PW,112 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state TSSOP2 20-Pin | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state QFN 20-Pin | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state SOP 20-Pin | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state SOP 20-Pin | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state TSSOP2 20-Pin | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state QFN 20-Pin | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state SOP 20-Pin | 74AHC541; 74AHCT541 - Octal buffer/line driver; 3-state TSSOP2 20-Pin |
| Brand Name | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 零件包装代码 | TSSOP2 | QFN | SOP | SOP | TSSOP2 | QFN | SOP | TSSOP2 |
| 包装说明 | TSSOP, | HVQCCN, | SOP-20 | SOP-20 | TSSOP-20 | DHVQFN-20 | SOP, | TSSOP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 制造商包装代码 | SOT360-1 | SOT764-1 | SOT163-1 | SOT163-1 | SOT360-1 | SOT764-1 | SOT163-1 | SOT360-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 其他特性 | WITH DUAL OUTPUT ENABLE | - | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | WITH DUAL OUTPUT ENABLE | - | - | WITH DUAL OUTPUT ENABLE |
| 系列 | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHCT/VHCT/VT | - | AHCT/VHCT/VT |
| JESD-30 代码 | R-PDSO-G20 | R-PQCC-N20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PQCC-N20 | - | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - | e4 |
| 长度 | 6.5 mm | 4.5 mm | 12.8 mm | 12.8 mm | 6.5 mm | 4.5 mm | - | 6.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | - | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVQCCN | SOP | SOP | TSSOP | HVQCCN | - | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | - | 260 |
| 传播延迟（tpd） | 13.5 ns | 13.5 ns | 13.5 ns | 13.5 ns | 13.5 ns | 11 ns | - | 11 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.1 mm | 1 mm | 2.65 mm | 2.65 mm | 1.1 mm | 1 mm | - | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 5 V | - | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD | - | GULL WING |
| 端子节距 | 0.65 mm | 0.5 mm | 1.27 mm | 1.27 mm | 0.65 mm | 0.5 mm | - | 0.65 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | - | 30 |
| 宽度 | 4.4 mm | 2.5 mm | 7.5 mm | 7.5 mm | 4.4 mm | 2.5 mm | - | 4.4 mm |
| Samacsys Confidence | - | 2 | 2 | 2 | 2 | 2 | - | - |
| Samacsys Status | - | Released | Released | Released | Released | Released | - | - |
| Samacsys PartID | - | 1283732 | 1283731 | 1007561 | 953661 | 600587 | - | - |
| Samacsys Pin Count | - | 21 | 20 | 20 | 20 | 21 | - | - |
| Samacsys Part Category | - | Integrated Circuit | Integrated Circuit | Integrated Circuit | Integrated Circuit | Integrated Circuit | - | - |
| Samacsys Package Category | - | Other | Small Outline Packages | Small Outline Packages | Small Outline Packages | Other | - | - |
| Samacsys Footprint Name | - | DHVQFN20 (SOT764-1) | SO20 | SO20 | SOT360-1 | DHVQFN20 (SOT764-1) | - | - |
| Samacsys Released Date | - | 2019-10-01 15:16:08 | 2019-11-12 07:41:52 | 2019-11-12 07:41:52 | 2019-11-12 07:41:52 | 2019-11-12 07:41:52 | - | - |
| Is Samacsys | - | N | N | N | N | N | - | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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