S-93C66ADFJ概述

EEPROM, 256X16, Serial, CMOS, PDSO8, SOP2-8

S-93C66ADFJ规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	ABLIC
零件包装代码	SOIC
包装说明	SOP, SOP8,.25
针数	8
Reach Compliance Code	compliant
ECCN代码	EAR99
其他特性	DATA RETENTION: 10 YEARS
最大时钟频率 (fCLK)	2 MHz
数据保留时间-最小值	10
耐久性	1000000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8
JESD-609代码	e0
长度	4.9 mm
内存密度	4096 bit
内存集成电路类型	EEPROM
内存宽度	16
功能数量	1
端子数量	8
字数	256 words
字数代码	256
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	256X16
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP8,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
并行/串行	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	2/5 V
认证状态	Not Qualified
座面最大高度	1.75 mm
串行总线类型	MICROWIRE
最大待机电流	4e-7 A
最大压摆率	0.002 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.8 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	TIN LEAD
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	3.9 mm
最长写入周期时间 (tWC)	10 ms
写保护	SOFTWARE

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Contents

Features .............................................................. 1

Pin Assignment ................................................... 1

Pin Functions ...................................................... 1

Block Diagram ..................................................... 2

Instruction Set ..................................................... 2

Absolute Maximum Ratings................................. 2

Recommended Operating Conditions ................. 3

Pin Capacitance .................................................. 3

Endurance........................................................... 3

DC Electrical Characteristics ............................... 4

AC Electrical Characteristics ............................... 5

Operation ............................................................ 6

Receiving a Start-Bit............................................ 13

Three-wire Interface (DI-DO direct connection) ... 13

Dimensions (Unit : mm) ....................................... 14

Ordering Information ........................................... 17

Characteristics..................................................... 18

Frequently Asked Questions................................ 23

S-93C66ADFJ相似产品对比

	S-93C66ADFJ	S-93C46AFJ	S-93C46AMFN	S-93C56ADFJ	S-93C56ADP	S-93C56AFJ	S-93C56AFT	S-93C56AMFN	S-93C66AFJ	S-93C66AFT
描述	EEPROM, 256X16, Serial, CMOS, PDSO8, SOP2-8	EEPROM, 64X16, Serial, CMOS, PDSO8, SOP1-8	EEPROM, 64X16, Serial, CMOS, PDSO8, MSOP-8	EEPROM, 128X16, Serial, CMOS, PDSO8, SOP2-8	EEPROM, 128X16, Serial, CMOS, PDIP8, DIP-8	EEPROM, 128X16, Serial, CMOS, PDSO8, SOP1-8	EEPROM, 128X16, Serial, CMOS, PDSO8, TSSOP-8	EEPROM, 128X16, Serial, CMOS, PDSO8, MSOP-8	EEPROM, 256X16, Serial, CMOS, PDSO8, SOP1-8	EEPROM, 256X16, Serial, CMOS, PDSO8, TSSOP-8
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC	ABLIC
零件包装代码	SOIC	SOIC	MSOP	SOIC	DIP	SOIC	SOIC	MSOP	SOIC	SOIC
包装说明	SOP, SOP8,.25	SOP, SOP8,.25	LSSOP, SSOP8,.16	SOP, SOP8,.25	DIP, DIP8,.3	SOP, SOP8,.25	TSSOP, TSSOP8,.25	LSSOP, SSOP8,.16	SOP, SOP8,.25	TSSOP, TSSOP8,.25
针数	8	8	8	8	8	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
其他特性	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS	DATA RETENTION: 10 YEARS
最大时钟频率 (fCLK)	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz
数据保留时间-最小值	10	10	10	10	10	10	10	10	10	10
耐久性	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
长度	4.9 mm	4.9 mm	2.95 mm	4.9 mm	9.3 mm	4.9 mm	4.4 mm	2.95 mm	4.9 mm	4.4 mm
内存密度	4096 bit	1024 bit	1024 bit	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit	4096 bit	4096 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	16	16	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8	8	8	8
字数	256 words	64 words	64 words	128 words	128 words	128 words	128 words	128 words	256 words	256 words
字数代码	256	64	64	128	128	128	128	128	256	256
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	256X16	64X16	64X16	128X16	128X16	128X16	128X16	128X16	256X16	256X16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	SOP	LSSOP	SOP	DIP	SOP	TSSOP	LSSOP	SOP	TSSOP
封装等效代码	SOP8,.25	SOP8,.25	SSOP8,.16	SOP8,.25	DIP8,.3	SOP8,.25	TSSOP8,.25	SSOP8,.16	SOP8,.25	TSSOP8,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.75 mm	1.75 mm	1.3 mm	1.75 mm	4.5 mm	1.75 mm	1.2 mm	1.3 mm	1.75 mm	1.2 mm
串行总线类型	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE
最大待机电流	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A	4e-7 A
最大压摆率	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
标称供电电压 (Vsup)	5 V	2.5 V	2.5 V	5 V	5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	NO	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb)	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb)	TIN LEAD	TIN LEAD
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	1.27 mm	1.27 mm	0.65 mm	1.27 mm	2.54 mm	1.27 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	3.9 mm	3.9 mm	2.8 mm	3.9 mm	7.62 mm	3.9 mm	3 mm	2.8 mm	3.9 mm	3 mm
最长写入周期时间 (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
写保护	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE

S-93C66ADFJ

S-93C66ADFJ概述

S-93C66ADFJ规格参数

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S-93C66ADFJ相似产品对比

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