RF and Baseband Circuit, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 1 week |
| MAX2363ETM | MAX2365ETM+ | MAX2361ETM+ | MAX2361ETM+T | MAX2363ETM+ | MAX2363ETM+T | MAX2365ETM+T | MAX2361ETM | MAX2361ETM-TB4A | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | RF and Baseband Circuit, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | IC transmitter quad 48tqfn-EP | IC transmitter quad 48tqfn-EP | IC transmitter quad 48tqfn-EP | IC transmitter quad 48tqfn-EP | IC transmitter quad 48tqfn-EP | IC transmitter quad 48tqfn-EP | RF and Baseband Circuit, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | RF and Baseband Circuit, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, TQFN-48 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | HVQCCN, | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | HVQCCN, LCC48,.27SQ,20 | 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 | HVQCCN, | 7 X 7 MM, 0.90 MM HEIGHT, MO-220, TQFN-48 |
| Reach Compliance Code | compliant | compli | compli | compli | compli | compli | compli | compliant | not_compliant |
| 零件包装代码 | QFN | QFN | QFN | QFN | QFN | QFN | QFN | QFN | - |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - |
| JESD-30 代码 | - | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 | - | - | S-XQCC-N48 | S-XQCC-N48 | S-XQCC-N48 |
| JESD-609代码 | - | e3 | e3 | e3 | - | - | e3 | e0 | e0 |
| 长度 | - | 7 mm | 7 mm | 7 mm | - | - | 7 mm | 7 mm | 7 mm |
| 湿度敏感等级 | - | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | - | 48 | 48 | 48 | - | - | 48 | 48 | 48 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | - | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | HVQCCN | HVQCCN | HVQCCN | - | - | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | - | SQUARE | SQUARE | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | - | - | 260 | 240 | NOT SPECIFIED |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 0.8 mm | 0.8 mm | 0.8 mm | - | - | 0.8 mm | 0.8 mm | 1 mm |
| 标称供电电压 | - | 2.8 V | 2.8 V | 2.8 V | - | - | 2.8 V | 2.8 V | 2.8 V |
| 表面贴装 | - | YES | YES | YES | - | - | YES | YES | YES |
| 电信集成电路类型 | - | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | - | - | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT | RF AND BASEBAND CIRCUIT |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | TIN | TIN | TIN | - | - | TIN | TIN LEAD | Tin/Lead (Sn85Pb15) |
| 端子形式 | - | NO LEAD | NO LEAD | NO LEAD | - | - | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | - | - | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | QUAD | QUAD | QUAD | - | - | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | 20 | NOT SPECIFIED |
| 宽度 | - | 7 mm | 7 mm | 7 mm | - | - | 7 mm | 7 mm | 7 mm |
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