Line Driver/Receiver, 2 Driver, CDIP16,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| MAX232MJE/883 | MAX236CRG | MAX238CEG | MAX236CEG | MAX239CEG | MAX237CEG | MAX246EPE | MAX231MLP/883B | MAX232CWE/HR | MAX232MLP/883 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Line Driver/Receiver, 2 Driver, CDIP16, | Line Driver/Receiver, 4 Driver, CMOS, CDIP24 | Line Driver/Receiver, 4 Driver, CMOS, PDSO24, | Line Driver/Receiver, 4 Driver, CMOS, PDSO24, | Line Driver/Receiver, 3 Driver, CMOS, PDSO24 | Line Driver/Receiver, 5 Driver, CMOS, PDSO24 | Interface Circuit, | Line Driver/Receiver, 2 Driver, CMOS, CQCC20 | Line Driver/Receiver, 2 Driver, PDSO16 | Line Driver/Receiver, 2 Driver, CQCC20, |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | - | - | EAR99 |
| 差分输出 | - | NO | NO | NO | NO | NO | - | NO | NO | NO |
| 驱动器位数 | - | 4 | 4 | 4 | 3 | 5 | - | 2 | 2 | 2 |
| JESD-30 代码 | - | R-XDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - | S-XQCC-N20 | R-PDSO-G16 | S-XQCC-N20 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 |
| 端子数量 | - | 24 | 24 | 24 | 24 | 24 | - | 20 | 16 | 20 |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | 125 °C | 70 °C | 125 °C |
| 最小输出摆幅 | - | 10 V | 10 V | 10 V | 10 V | 10 V | - | 10 V | 10 V | 10 V |
| 最大输出低电流 | - | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A | 0.0016 A | - | 0.0032 A | 0.0032 A | 0.0032 A |
| 封装主体材料 | - | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | CERAMIC | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | - | DIP | SOP | SOP | SOP | SOP | - | QCCN | SOP | QCCN |
| 封装等效代码 | - | DIP24,.3 | SOP24,.4 | SOP24,.4 | SOP24,.4 | SOP24,.4 | - | LCC20,.35SQ | SOP16,.4 | LCC20,.35SQ |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER |
| 电源 | - | 5 V | 5 V | 5 V | 5,12 V | 5 V | - | 5,12 V | 5 V | 5 V |
| 最大压摆率 | - | 15 mA | 15 mA | 15 mA | - | 15 mA | - | - | 10 mA | 10 mA |
| 标称供电电压 | - | 5 V | 5 V | 5 V | - | 5 V | - | - | 5 V | 5 V |
| 表面贴装 | - | NO | YES | YES | YES | YES | - | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | - | - |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | MILITARY | COMMERCIAL | MILITARY |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | - | NO LEAD | GULL WING | NO LEAD |
| 端子节距 | - | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL | - | QUAD | DUAL | QUAD |
| 高电平输入电流最大值 | - | - | 0.0002 A | 0.0002 A | 0.0002 A | 0.0002 A | - | - | 0.0002 A | 0.0002 A |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
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