Operational Amplifier,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Raytheon Company |
Reach Compliance Code | unknown |
放大器类型 | OPERATIONAL AMPLIFIER |
JESD-609代码 | e0 |
峰值回流温度(摄氏度) | NOT SPECIFIED |
端子面层 | Tin/Lead (Sn/Pb) |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
RM709T/883B | RM709T | RM709CQ | RM709CQ/883B | RM709DC/883B | RM709DC | RC709T | |
---|---|---|---|---|---|---|---|
描述 | Operational Amplifier, | Operational Amplifier, 1 Func, 4000uV Offset-Max, BIPolar, MBCY8, | Operational Amplifier, 1 Func, 4000uV Offset-Max, BIPolar, CDFP10, | Operational Amplifier, 1 Func, 4000uV Offset-Max, BIPolar, CDFP10, | Operational Amplifier, 1 Func, 4000uV Offset-Max, BIPolar, CDIP14, | Operational Amplifier, 1 Func, 4000uV Offset-Max, BIPolar, CDIP14, | Operational Amplifier, 1 Func, 10000uV Offset-Max, BIPolar, MBCY8, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
厂商名称 | Raytheon Company | Raytheon Company | - | - | Raytheon Company | Raytheon Company | - |
架构 | - | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
频率补偿 | - | NO | NO | NO | NO | NO | NO |
最大输入失调电压 | - | 4000 µV | 4000 µV | 4000 µV | 4000 µV | 4000 µV | 10000 µV |
JESD-30 代码 | - | O-MBCY-W8 | R-XDFP-F10 | R-XDFP-F10 | R-XDIP-T14 | R-XDIP-T14 | O-MBCY-W8 |
低-失调 | - | NO | NO | NO | NO | NO | NO |
功能数量 | - | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | 8 | 10 | 10 | 14 | 14 | 8 |
最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
封装主体材料 | - | METAL | CERAMIC | CERAMIC | CERAMIC | CERAMIC | METAL |
封装等效代码 | - | CAN8,.2 | FL10,.3 | FL10,.3 | DIP14,.3 | DIP14,.3 | CAN8,.2 |
封装形状 | - | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND |
封装形式 | - | CYLINDRICAL | FLATPACK | FLATPACK | IN-LINE | IN-LINE | CYLINDRICAL |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
技术 | - | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子形式 | - | WIRE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | WIRE |
端子位置 | - | BOTTOM | DUAL | DUAL | DUAL | DUAL | BOTTOM |
封装代码 | - | - | DFP | DFP | DIP | DIP | - |
表面贴装 | - | - | YES | YES | NO | NO | - |
端子节距 | - | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
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