Standard SRAM, 256KX4, 25ns, CMOS, CQCC28, 0.400 X 0.720 INCH, LCC-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QLCC |
| 包装说明 | 0.400 X 0.720 INCH, LCC-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 25 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-CQCC-N28 |
| JESD-609代码 | e0 |
| 长度 | 11.4554 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 28 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 256KX4 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC(UNSPEC) |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.54 mm |
| 最大待机电流 | 0.015 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.14 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.4554 mm |

| IDT71028S25LB | IDT71028S15P | IDT71028S12P | IDT71028S17TY | IDT71028S17LB | IDT71028S12TY | IDT71028S15LB | IDT71028S15TY | IDT71028S17P | IDT71028S20LB | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX4, 25ns, CMOS, CQCC28, 0.400 X 0.720 INCH, LCC-28 | Standard SRAM, 256KX4, 15ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 | Standard SRAM, 256KX4, 12ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 | Standard SRAM, 256KX4, 17ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 256KX4, 17ns, CMOS, CQCC28, 0.400 X 0.720 INCH, LCC-28 | Standard SRAM, 256KX4, 12ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 256KX4, 15ns, CMOS, CQCC28, 0.400 X 0.720 INCH, LCC-28 | Standard SRAM, 256KX4, 15ns, CMOS, PDSO28, 0.300 INCH, SOJ-28 | Standard SRAM, 256KX4, 17ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 | Standard SRAM, 256KX4, 20ns, CMOS, CQCC28, 0.400 X 0.720 INCH, LCC-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QLCC | DIP | DIP | SOJ | QLCC | SOJ | QLCC | SOJ | DIP | QLCC |
| 包装说明 | 0.400 X 0.720 INCH, LCC-28 | 0.400 INCH, PLASTIC, DIP-28 | 0.400 INCH, PLASTIC, DIP-28 | 0.300 INCH, SOJ-28 | 0.400 X 0.720 INCH, LCC-28 | 0.300 INCH, SOJ-28 | 0.400 X 0.720 INCH, LCC-28 | 0.300 INCH, SOJ-28 | 0.400 INCH, PLASTIC, DIP-28 | 0.400 X 0.720 INCH, LCC-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A001.A.2.C | 3A991.B.2.B | 3A001.A.2.C | 3A991.B.2.B | 3A991.B.2.B | 3A001.A.2.C |
| 最长访问时间 | 25 ns | 15 ns | 12 ns | 17 ns | 17 ns | 12 ns | 15 ns | 15 ns | 17 ns | 20 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-CQCC-N28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-J28 | S-CQCC-N28 | R-PDSO-J28 | S-CQCC-N28 | R-PDSO-J28 | R-PDIP-T28 | S-CQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 11.4554 mm | 35.56 mm | 35.56 mm | 17.9324 mm | 11.4554 mm | 17.9324 mm | 11.4554 mm | 17.9324 mm | 35.56 mm | 11.4554 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| 组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | DIP | SOJ | QCCN | SOJ | QCCN | SOJ | DIP | QCCN |
| 封装等效代码 | LCC(UNSPEC) | DIP28,.4 | DIP28,.4 | SOJ28,.34 | LCC(UNSPEC) | SOJ28,.34 | LCC(UNSPEC) | SOJ28,.34 | DIP28,.4 | LCC(UNSPEC) |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.54 mm | 5.334 mm | 5.334 mm | 3.556 mm | 2.54 mm | 3.556 mm | 2.54 mm | 3.556 mm | 5.334 mm | 2.54 mm |
| 最大待机电流 | 0.015 A | 0.01 A | 0.01 A | 0.01 A | 0.015 A | 0.01 A | 0.015 A | 0.01 A | 0.01 A | 0.015 A |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | 0.14 mA | 0.15 mA | 0.155 mA | 0.145 mA | 0.165 mA | 0.155 mA | 0.175 mA | 0.15 mA | 0.145 mA | 0.155 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES | YES | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | J BEND | NO LEAD | J BEND | NO LEAD | J BEND | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD |
| 宽度 | 11.4554 mm | 10.16 mm | 10.16 mm | 7.5184 mm | 11.4554 mm | 7.5184 mm | 11.4554 mm | 7.5184 mm | 10.16 mm | 11.4554 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved