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S-LMUN5135T1G

产品描述Small Signal Bipolar Transistor,
产品类别分立半导体    晶体管   
文件大小237KB,共12页
制造商LRC
官网地址http://www.lrc.cn
标准  
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S-LMUN5135T1G概述

Small Signal Bipolar Transistor,

S-LMUN5135T1G规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称LRC
包装说明,
Reach Compliance Codeunknown
峰值回流温度(摄氏度)NOT SPECIFIED
处于峰值回流温度下的最长时间NOT SPECIFIED

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LESHAN RADIO COMPANY, LTD.
Bias Resistor Transistor
PNP Silicon Surface Mount Transistor
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The BRT (Bias Resistor
Transistor) contains a single transistor with a monolithic bias network
consisting of two resistors; a series base resistor and a base–emitter
resistor. The BRT eliminates these individual components by integrating
them into a single device. The use of a BRT can reduce both system cost
and board space. The device is housed in the SC–70/SOT–323 package
which is designed for low power surface mount applications.
1
2
LMUN5111T1G
Series
S-LMUN5111T1G
Series
PNP SILICON
BIAS RESISTOR
TRANSISTORS
3
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
The SC–70/SOT–323 package can be soldered using wave or reflow.
The modified gull–winged leads absorb thermal stress during soldering
eliminating the possibility of damage to the die.
PIN 1
BASE
(INPUT)
CASE 419, STYLE 3
SOT–323 (SC–70)
PIN 3
R
1
COLLECTOR
(OUTPUT)
PIN 2
EMITTER
(GROUND)
R
2
We declare that the material of product compliance with RoHS requirements.
S- Prefix for Automotive and Other Applications Requiring Unique Site and
Control Change Requirements; AEC-Q101 Qualified and PPAP Capable.
ORDERING INFORMATION
MARKINGDIAGRAM
Device
LMUN5111T1G Series
S-LMUN5111T1G Series
LMUN5111T3G Series
S-LMUN5111T3G Series
Package
SOT323
SOT323
Shipping
3000/Tape&Reel
10000/Tape&Reel
6X
M
6X
X
M
=Specific Device Code
=(See Marking Table)
=Date Code
MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
Rating
Symbol
Value
Collector-Base Voltage
V
CBO
50
Collector-Emitter Voltage
Collector Current
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
T
A
= 25°C
Derate above 25°C
Thermal Resistance –
Junction-to-Ambient
Thermal Resistance –
Junction-to-Lead
Junction and Storage
Temperature Range
1. FR–4 @ Minimum Pad
2. FR–4 @ 1.0 x 1.0 inch Pad
R
θJA
R
θJL
T
J
, T
stg
V
CEO
I
C
Symbol
P
D
50
100
Unit
Vdc
Vdc
mAdc
Max
202 (Note 1)
310 (Note 2)
1.6 (Note 1)
2.5 (Note 2)
618 (Note 1)
403 (Note 2)
280 (Note 1)
332 (Note 2)
–55 to +150
Unit
mW
°C/W
°C/W
°C/W
°C
Rev.A 1/12

 
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